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Quispe Haro, Juan José (author), Chen, Fei (author), Los, R. (author), Shi, Shuqi (author), Sun, Wenjun (author), Chen, Yong (author), Idema, T. (author), Wegner, Seraphine V. (author)The transition of bacteria from an individualistic to a biofilm lifestyle profoundly alters their biology. During biofilm development, the bacterial cell-cell adhesions are a major determinant of initial microcolonies, which serve as kernels for the subsequent microscopic and mesoscopic structure of the biofilm, and determine the resulting...journal article 2024
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Shi, Baocun (author), Liu, Quan (author), Gao, Y. (author), Wu, Jiantao (author), Chen, Jingya (author)The occurrence of cohesive/adhesive hybrid failure at the bitumen-aggregate interface is widely acknowledged, however, the quantitative evaluation of the cohesion/adhesion proportion is relatively weak. This study explored cohesive/adhesive hybrid failure and provided a quantitative analysis of the proportion between cohesion and adhesion....journal article 2023
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Zou, Yingxue (author), Xu, Haiqin (author), Xu, S. (author), Chen, Anqi (author), Wu, Shaopeng (author), Amirkhanian, Serji (author), Wan, Pei (author), Gao, Xiang (author)Moisture erosion is one of the key factors leading to asphalt pavement damage, and the erosion depth indicates the moisture damage level but it is usually neglected. In order to study the moisture erosion and the erosion depth, this study characterized the chemical structure, rheological property and adhesion property of asphalt at different...journal article 2023
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Cui, Z. (author), Chen, Xianping (author), Fan, Xuejun (author), Zhang, Kouchi (author)Interfacial properties of Cu/SiO2 in semiconductor devices has continued to be the subject of challenging study for many years because of its difficulties in experimentally quantifying the critical strength of interface. In this paper, a multi-scale modeling approach is built to characterize the interfacial properties between Cu and SiO2. In...conference paper 2018
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Cui, Z. (author), Zhang, Yingying (author), Yang, Qun (author), Zhang, Kouchi (author), Chen, Xianping (author)Interfacial properties of Cu/SiO<sub>2</sub> in semiconductor devices has been a challenging study for many years because of its difficulties in experimentally quantifying the critical strength of interface. In this paper, a multi-scale modeling approach is built to characterize the interfacial properties between Cu and SiO<sub>2</sub>. The...conference paper 2018