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  • (-) subject:"Antenna\ in\ Package"

Collection

  • Institutional Repository (3)
  • Student theses (2)

Document type

  • journal article (2)
  • master thesis (2)
  • doctoral thesis (1)

Subject

  • Antenna in Package (2)
  • 0.13-µm silicon germanium bipolar complementary metal-oxide semiconductor (SiGe BiCMOS) (1)
  • 3D integration (1)
  • 6G (1)
  • Antenna-in-package (1)
  • Feeding network (1)
  • Film assisted molding (1)
  • H-band (1)
  • Impedance matching (1)
  • Mechanical characterization (1)
  • Microelectronic packaging (1)
  • Optical encoder (1)
  • PCB (1)
  • Polymer (1)
  • QFN (1)
  • Radar (1)
  • SU-8 (1)
  • Shear test (1)
  • System-in-package (SiP) (1)
  • Through-Polymer Via (1)
  • Vertical interconnection (1)
  • air-bridge chip interconnect (1)
  • antenna-in-package (1)
  • coaxial (1)
  • efficiency-enhancement (1)
  • film-assisted molding (1)
  • leaky-wave antenna (1)
  • lens antenna (1)
  • metalized polymer (1)
  • mm-wave (1)
  • monostatic frequency modulated continuous-wave (FMCW) radar (1)
  • off-chip antenna (1)
  • patch antennas (1)
  • radar antenna-in-package (AiP) (1)
  • system-in-package (SiP) (1)
  • through-polymer via (TPV) (1)
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Author

  • Yi (2)
  • Arias Campo (1)
  • Bruni (1)
  • Damian (1)
  • De Martino (1)
  • Debski (1)
  • Holc (1)
  • Koelink (1)
  • Kooij (1)
  • Krimmling (1)
  • Leuther (1)
  • Liu (1)
  • Llombart (1)
  • Poelma (1)
  • Spirito (1)
  • Weber (1)
  • Zhang (1)
  • van Zeijl (1)
  • Öztürk (1)
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Date

2020 - 2024
(years)
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Format: 2023/10/01
Searched for: subject%3A%22Antenna%255C%2Bin%255C%2BPackage%22
(1 - 5 of 5)
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6G Beamforming Antenna-in-Package
6G Beamforming Antenna-in-Package: Improving Efficiency using Direct Impedance Matching
Design of the AiP feeding lines for 6G applications in a high definition fan-out technology
Design of the AiP feeding lines for 6G applications in a high definition fan-out technology
Antenna-in-Package (AiP) Using Through-Polymer Vias (TPVs) for a 122-GHz Radar Chip
Antenna-in-Package (AiP) Using Through-Polymer Vias (TPVs) for a 122-GHz Radar Chip
H-band Quartz-Silicon Leaky-Wave Lens with Air-Bridge Interconnect to GaAs Front-End
H-band Quartz-Silicon Leaky-Wave Lens with Air-Bridge Interconnect to GaAs Front-End
Through Package Via: A bottom-up approach
Through Package Via: A bottom-up approach
Searched for: subject%3A%22Antenna%255C%2Bin%255C%2BPackage%22
(1 - 5 of 5)
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