To Spike or Not To Spike: A Digital Hardware Perspective on Deep Learning Acceleration

As deep learning models scale, they become increasingly competitive from domains spanning from computer vision to natural language processing; however, this happens at the expense of efficiency since they require increasingly more memory and computing power. The power efficiency of the biological brain outperforms any large-scale deep...

Continuous Occupancy Mapping in Dynamic Environments Using Particles

Particle-based dynamic occupancy maps were proposed in recent years to model the obstacles in dynamic environments. Current particle-based maps describe the occupancy status in discrete grid form and suffer from the grid size problem, wherein a large grid size is unfavorable for motion planning while a small grid size lowers efficiency and...

A Cellular Automata Model of Oncolytic Virotherapy in Pancreatic Cancer

Oncolytic virotherapy is known as a new treatment to employ less virulent viruses to specifically target and damage cancer cells. This work presents a cellular automata model of oncolytic virotherapy with an application to pancreatic cancer. The fundamental biomedical processes (like cell proliferation, mutation, apoptosis) are modeled by the...

A 3D separable cohesive element for modelling the coupled failure in laminated composite materials

The interaction between matrix cracks and interface delamination is a major failure mechanism in composite laminates and has been a subject of active research in recent years. Although coupled failure behaviour of composite laminates between matrix cracks and delamination has been observed in experiments, accurate modelling of this phenomenon...

A separable cohesive element for modelling coupled failure in laminated composite materials

A three-dimensional separable cohesive element (SCE) is proposed to enable the modelling of interaction between matrix cracking and interfacial delamination in laminated fibre-reinforced composite materials. It is demonstrated that traditional cohesive elements are incapable of modelling the coupled failure mechanisms accurately if...

Interfacial Failure Characterization of Electronic Packaging Component Using a Multiscale Modelling Approach

Interfacial properties of Cu/SiO₂ in semiconductor devices has been a challenging study for many years because of its difficulties in experimentally quantifying the critical strength of interface. In this paper, a multi-scale modeling approach is built to characterize the interfacial properties between Cu and SiO₂. The...