Searched for: subject%3A%22Copper%22
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Pinto, D. (author), Minorello, S. (author), Zhou, Zhouping (author), Urakawa, A. (author)
Carbon dioxide capture and reduction (CCR) process emerges as an efficient catalytic strategy for CO<sub>2</sub> capture and conversion to valuable chemicals. K-promoted Cu/Al<sub>2</sub>O<sub>3</sub> catalysts exhibited promising CO<sub>2</sub> capture efficiency and highly selective conversion to syngas (CO + H<sub>2</sub>). The dynamic...
journal article 2024
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Houtkoop, Mariëtte (author)
This research aimed to optimize the process parameters of small copper parts printed with binder jetting. The optimisation was distinguished by dividing the parameters in print and post-process parameters. Binder jetting is an additive manufacturing technique that combines layers of the material in powder form with a binder. After the printing...
master thesis 2023
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Puchol Morejón, Eduardo (author)
master thesis 2023
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Chen, N. (author)
The issue of climate change, including global warming, poses a significant challenge to our planet. In response to this challenge, the Paris Agreement was signed, which aims to limit the rise in global temperatures to well below 2 <sup style="--tw-border-spacing-x: 0; --tw-border-spacing-y: 0; --tw-translate-x: 0; --tw-translate-y: 0; --tw...
doctoral thesis 2023
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Meershoek, Laurens (author)
Tailings are a waste product of primary metal production. Although these metals contribute to the development of modern technology and renewable energy systems, tailings pose significant environmental, economic, and human health risks. Stored behind a dam in tailings storage facilities (TSFs) these waste materials are meant to be isolated from...
master thesis 2023
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Sajeev Kumar, A. (author), Moura de Salles Pupo, M. (author), Petrov, K.V. (author), Ramdin, M. (author), van Ommen, J.R. (author), de Jong, W. (author), Kortlever, R. (author)
Aqueous electrolytes used in CO2 electroreduction typically have a CO2 solubility of around 34 mM under ambient conditions, contributing to mass transfer limitations in the system. Non-aqueous electrolytes exhibit higher CO2 solubility (by 5–8-fold) and also provide possibilities to suppress the undesired hydrogen evolution reaction (HER). On...
journal article 2023
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Neeft, Tobias (author)
Silicon wafers and solar cells are delicate components used in the semiconductor industries and energy industries. Handling and transportation can easily damage these components. Conventional handling methods with mechanical contact can cause various damages to these delicate surfaces. Air bearings can provide a solution by enabling an almost...
master thesis 2023
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Phongprueksathat, N. (author)
Since the industrial revolution in the 1760s, the CO2 concentration in the atmosphere has been rising incessantly driving global warming closer to the point of no return. The world requires urgent actions to not only reduce CO2 emissions but also capture the CO2 for utilization to mitigate the future environmental crisis. CO2 hydrogenation to...
doctoral thesis 2023
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Santos, Janaina S. (author), Márquez, Victor (author), Buijnsters, J.G. (author), Praserthdam, Supareak (author), Praserthdam, Piyasan (author)
This study presents environmentally friendly and low-cost synthetic routes to produce antimicrobial coatings over 5052 Al alloy based on plasma electrolytic oxidation (PEO) technology. Two methodologies were explored: the decoration with copper and anodic doping with copper ions. The porous oxide layers produced in silicate media presented...
journal article 2023
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Brudzisz, Anna (author), Giziński, Damian (author), Liszewska, Malwina (author), Wierzbicka, Ewa (author), Tiringer, U. (author), Taha, Safeya A. (author), Zając, Marcin (author), Orzechowska, Sylwia (author), Jankiewicz, Bartłomiej (author), Taheri, P. (author), Stępniowski, Wojciech J. (author)
The low-voltage (&lt; 5 V) anodization of copper in aqueous solutions of sodium bicarbonate was studied for the first time. As demonstrated, this method leads to the formation of microstructures on a copper surface, that are composed of malachite (CuCO<sub>3</sub>·Cu(OH)<sub>2</sub>). Moreover, by tuning the operating conditions, i.e.,...
journal article 2023
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Hagen, W.R. (author)
Electron paramagnetic resonance spectroscopy is a long-standing method for the exploration of electronic structures of transition ion complexes. The difficulty of its analysis varies considerably, not only with the nature of the spin system, but more so with the relative magnitudes of the magnetic interactions to which the spin is subject, where...
journal article 2023
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Alali, Arkan (author), Hosseini-Abari, Afrouzossadat (author), Bahrami, A. (author), Yazdan Mehr, M. (author)
Modification of paint with nanoparticles (NPs) provides self-cleaning, water/dirt-repellent, and other properties. Therefore, the aim of the present study was to biosynthesize silver (Ag) and copper oxide (CuO) NPs and to prepare NP-modified paint. To this end, AgNPs and CuONPs were biosynthesized using Bacillus atrophaeus spores and commercial...
journal article 2023
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Zhang, Y. (author), Mo, J. (author), Cui, Z. (author), Vollebregt, S. (author), Zhang, Kouchi (author)
The continuous downscaling of microelectronics has introduced many reliability issues on interconnect. Electromigration and dewetting are major reliability concerns in high-temperature micro- and nanoscale devices. In this paper, the local dewetting of copper thin film during the electromigration test was first found and investigated. When...
conference paper 2023
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Hu, D. (author), Qian, Cheng (author), Liu, X. (author), Du, L. (author), Sun, Zhongchao (author), Fan, X. (author), Zhang, Kouchi (author), Fan, J. (author)
As a promising technology for high-power and high-temperature power electronics packaging, nanocopper (nanoCu) paste sintering has recently received increasing attention as a die-attachment. The high-temperature deformation of sintered nanoCu paste and its underlying mechanisms challenge the reliability of high-power electronics packaging. In...
journal article 2023
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Abdinejad, M. (author), Subramanian, S.S. (author), Motlagh, Mozhgan Khorasani (author), Ripepi, D. (author), Pinto, D. (author), Li, Mengran (author), Middelkoop, J. (author), Urakawa, A. (author), Burdyny, T.E. (author)
The electrochemical CO<sub>2</sub> reduction reaction (CO<sub>2</sub>RR) is an attractive method to produce renewable fuel and chemical feedstock using clean energy sources. Formate production represents one of the most economical target products from CO<sub>2</sub>RR but is primarily produced using post-transition metal catalysts that...
journal article 2023
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Chen, Wei (author), Jiang, Jing (author), Meda, Abdulmelik H. (author), Ibrahim, Mesfin S. (author), Zhang, Kouchi (author), Fan, J. (author)
SiC MOSFET is mainly characterized by the higher electric breakdown field, higher thermal conductivity, and lower switching loss enabling high breakdown voltage, high-temperature operation, and high switching frequency. However, their performances are considerably limited by the high parasitic inductance and poor heat dissipation capabilities...
journal article 2023
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Luo, T. (author), Ghaffarian Niasar, M. (author), Vaessen, P.T.M. (author)
Magnetic components are essential parts in many power electronic applications. Their characteristics deeply impact the performances of the applications. This article proposed a 2-D calculation method for frequency-dependent winding losses and leakage inductance of magnetic components of round conductors. The method does not have any...
journal article 2023
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Ji, X. (author), van Zeijl, H.W. (author), Jiao, Weiping (author), He, S. (author), Du, L. (author), Zhang, Kouchi (author)
The trend to 3D and heterogeneous integration enable driving multi-functional blocks in one package. Flip-chip integration is currently playing an important role and is based on solder joints. To overcome the limitations of solder joints, all-copper interconnects have been investigated to meet electrical, thermal, and reliability demands in...
conference paper 2023
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Shah, Mustafeez Bashir (author)
Many semiconductor sensors, particularly MEMS sensors such as inertial, temperature, pressure, and resonance sensors need a vacuum environment for optimal performance and sensitivity in addition to the improvement in their long-term reliability. With the rise of heterogeneous integration with the MEMS and ICs being integrated together, process...
master thesis 2022
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jiao, weiping (author)
This thesis investigates the all-copper fine pitch bonding process with photoimageable underfill. NanoCU paste is used as interconnect material. A bi-layer photo resist structure is manufactured and lithographic stencil printing is used to apply nanoCu paste. A new underfill injection method is realized by using epoxy resin based photo resist as...
master thesis 2022
Searched for: subject%3A%22Copper%22
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