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Inamdar, A.S. (author), Gromala, Przemyslaw Jakub (author), Prisacaru, Alexandru (author), Kabakchiev, Alexander (author), Yang, Yu Hsiang (author), Han, Bongtae (author)
Epoxy molding compound (EMC) is widely used for encapsulating automotive electronics. Among all of the components of an electronic package, EMC is most exposed to the atmosphere, and thus undergoes aging. During high-temperature operation, EMC is oxidized, which alters its mechanical properties, and thus can affect the reliability of electronic...
book chapter 2022
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Chang, Z. (author), Schlangen, E. (author), Šavija, B. (author)
This paper reports an extended lattice model for printing process simulation of 3D printed cementitious materials. In this model, several influencing factors such as material and geometric nonlinearity are considered. Using this model, green strength of cementitious material is investigated, deformation and crack pattern can be derived, which...
book chapter 2020