Improved RF Devices for Future Adaptive Wireless Systems Using Two-Sided Contacting and A1N Cooling

This paper reviews special RF/microwave silicon device implementations in a process that allows two-sided contacting of the devices: the back-wafer contacted silicon-on-glass (SOG) substrate-transfer technology (STT) developed at DIMES. In this technology, metal transmission lines can be placed on the low-loss glass substrate, while the...

Characterization and AlN cooling of thermally isolated bipolar transistors

Nowadays, electrothermal effects (ET) are posing fundamental issues in nearly all branches of micro- and nano-electronics. Due to either a high power dissipation level or to the aggressive electrical isolation schemes adopted to increase the speed, both high and low power devices are affected by ET effects that limit their reliability and cause...