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Martins Da Ponte, R. (author)The development of personalized healthcare solutions is a complex and multifaceted challenge that requires synergistic collaboration and cross-fertilization between multiple disciplines, including microelectronics, nanotechnology, materials science, and biotechnology. As numerous biomedical applications necessitate the precise regulation and...doctoral thesis 2023
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Gonen, B. (author)Analog-to-digital converters (ADCs) are an indispensable part of the digital age we are living in, as they form the interface between physical reality and virtual reality. Higher ADC energy efficiency is the dominant focus of ADC design research due to the high impact of ADC energy consumption to total energy consumption of the systems they are...doctoral thesis 2021
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van Wietmarschen, Luc (author)This work proposes a new charge pump design suitable for energy harvesting on small human wearable devices. By using only one system for both cold start and high efficiency harvesting, the required silicon area is heavily reduced. The most fitting energy transducer is determined to be a photovoltaic cell, based on aspects of voltage, power and...master thesis 2019
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Schriek, Edwin (author)With the advances towards a quantum computer incorporating many qubits, the demand for a scalable readout and control platform rises. Recent proposals for such a platform exploit the maturity of CMOS technology, to implement the various analog, RF and digital circuits required. To allow for scaling, the electronics that constitute this platform...master thesis 2018
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Xian, Chuhua (author), Jin, Shuo (author), Wang, C.C. (author)Handle-driven image warping based on linear blending is widely used in many applications because of its merits on intuitiveness, efficiency, and ease of implementation. In this paper, we develop a method to compute high-quality weights within a closed domain for image warping. The property of C<sub>2</sub> continuity in weights is guaranteed...journal article 2018
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Vollebregt, S. (author)Interconnects in integrated circuits (IC) are the major cause of power dissipation and delay. 3D integration has been proposed as a method to reduce these issues. For this 3D integration, fabrication of high aspect ratio reliable vertical interconnects (vias) are required. For this new materials, like carbon nanotubes (CNT), are being considered...doctoral thesis 2014
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Rana, V. (author)Abstract not availabledoctoral thesis 2006
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Schrik, E. (author)The research presented in this thesis was done in the context of the modeling of parasitic physical effects, like field couplings and crosstalk, that may adversely affect the functional performance of Integrated Circuits (ICs). The modeling of parasitic effects, through simulations with the resulting models, provides insight into the performance...doctoral thesis 2006
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Vorobyov, A.V. (author), Bagga, S. (author), Yarovoy, A.G. (author), Haddad, S.A.P. (author), Serdijn, W.A. (author), Long, J.R. (author), Irahhauten, Z. (author), Ligthart, L.P. (author)For impulse radio ultrawideband communications an “antenna plus generator” system is co-designed and an on chip generator is integrated into the antenna. This approach does away with the need for intermediate transmission lines conventionally placed between an RF device/generator and an antenna and therefore eliminates the need for a balun,...journal article