Searched for: subject:"MEMS"
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Zaliasl, S (author), Salvia, JC (author), Hill, GC (author), Chen, L (author), Joo, K (author), Palwai, R (author), Arumugam, N (author), Phadke, M (author), Mukherjee, S (author), Lee, HC (author), Grosjean, C (author), Hagelin, PM (author), Pamarti, S (author), Fiez, TS (author), Makinwa, K.A.A. (author), Partridge, A (author), Menon, V (author)
This
journal article 2015
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Rajaraman, V. (author), Hau, B.S. (author), Rocha, L.A. (author), French, P.J. (author), Makinwa, K.A.A. (author)
This work reports on the design and modeling of a new flexible contact-mode 1-DOF piezoresistive contact force and impacttime detector used for acceleration sensing in the time domain. The key advantages of the contact-mode detection mechanism are the use of simple readout circuitry, compactness, good linearity, scalability, and the potential to...
journal article 2010
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Rajaraman, V. (author), Makinwa, K.A.A. (author), French, P.J. (author)
We present a simple, flexible and low cost MEMS fabrication process, developed using deep reactive ion etching (DRIE) and wafer bonding technologies, for manufacturing in-plane high aspect ratio (HAR) inertial sensors. Among examples, the design and fabrication results of a two axis inertial device are presented. Fabricated device thickness...
conference paper 2008