Searched for: subject:"MEMS"
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document
Wu, K. (author), Tichem, M. (author)
Photonic packaging, which includes high-precision assembly of photonic sub-systems, is currently a bottleneck in the development of commercially-available integrated photonic products. In the pursuit of a fully-automated, high-precision, and cost-effective photonic alignment scheme for two multi-channel photonic chips, this paper explores...
journal article 2018
document
Wörhoff, Kerstin (author), Prak, Albert (author), Postma, F. (author), Leinse, A (author), Wu, K. (author), Peters, T.J. (author), Tichem, M. (author), Amaning-Appiah, B. (author), Renukappa, V. (author), Vollrath, G. (author), Balcells-Ventura, J. (author), Uhlig, P. (author), Seyfried, M. (author), Rose, D. (author), Santos, Raquel (author), Leijtens, XJM (author), Flintham, B. (author), Wale, M. (author), Robbins, D. (author)
Fully automated, high precision, cost-effective assembly technology for photonic packages remains one of the main challenges in photonic component manufacturing. Next to the cost aspect the most demanding assembly task for multiport photonic integrated circuits (PICs) is the high-precision (±0.1 μm) alignment and fixing required for optical I...
conference paper 2016
document
Wu, K. (author), Peters, T.J. (author), Tichem, M. (author), Postma, Ferry (author), Prak, Albert (author), Wörhoff, Kerstin (author), Leinse, Arne (author)
This paper proposes and tests a design of electro-thermal bimorph actuators for alignment of flexible photonic waveguides fabricated in 16 μm thick SiO<sup>2</sup>. The actuators are for use in a novel alignment concept for multi-port photonic integrated circuits (PICs), in which the fine alignment is taken care of by positioning of suspended...
conference paper 2016