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Smeets, E.M.J. (author), Bijnen, F.C.G. (author), Slabbekoorn, J. (author), Van Zeijl, H.W. (author)
In the MEMS world, increasing attention is being given to 3D devices requiring dual-sided processing. This requires lithography tools that are able to align a wafer to both its back side as front side. Overlay describes how well front and back side layers are positioned with respect to each other. Currently there is no simple and fast method to...
conference paper 2004