Searched for: subject:"MEMS"
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Tian, J. (author)
The current trend in electronic packaging research is to integrate more functions into one package, reduce electrical path parasitic, and increase the heat conduction in order to make the final packaged system smaller, more reliable, more functional and more complete, while keeping the packaging cost low. In this trend, unconventional devices ...
doctoral thesis 2013
Zaal, J.J.M. (author), Van Driel, W.D. (author), Zhang, G.Q. (author)
This paper discusses the assembly challenges considering the design and manufacturability of a Wafer Level Thin Film Package in MEMS applications. The assembly processes are discussed. The loads associated with these processes are illustrated and evaluated. Numerical calculations are combined with experimental observations in order to estimate...
journal article 2010