Searched for: subject:"MEMS"
(1 - 20 of 66)

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Houtgast, E.J. (author), Sima, V.M. (author), Bertels, K.L.M. (author), Al-Ars, Z. (author)
We are rapidly entering the era of genomics. The dramatic cost reduction of DNA sequencing due to the introduction of Next Generation Sequencing (NGS) techniques has resulted in an exponential growth of genetics data. The amount of data generated, and its associated processing into useful information, poses serious computational challenges. Here...
abstract 2016
document
De Athayde Costa E Silva, M. (author), Cordeiro Guerrieri, D. (author), Cervone, A. (author)
This paper presents a dynamic system approach for the modeling of fluid flow in microchannels to be used in thrust control applications. A micro-resistojet fabricated using MEMS (Microelectromechanical Systems) technology has been selected for the analysis. The device operates by vaporizing a liquid propellant, in this case water, and expelling...
conference paper 2016
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Pakula, L.S. (author), Rajaraman, V. (author), French, P.J. (author)
The operation principle, design, fabrication and measurement results of a quasi digital accelerometer fabricated on a thin silicon-on-insulator (SOI) substrate is presented. The accelerometer features quasi-digital output, therefore eliminating the need for analogue signal conditioning. The accelerometer can be directly interfaced to digital...
conference paper 2009
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de Graaf, G. (author), Abarca Prouza, A.N. (author), Wolfenbuttel, R.F. (author)
Conventional thermal conductivity detectors (TCDs) demonstrate a flow dependence. The approach presented here to reduce the flow dependence is based on the on-line flow compensation using two thin-film sensors on membranes in parallel on the same chip that are differentially operated. These are laterally identically, but with a different depth...
conference paper 2015
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Middelburg, L.M. (author), el Mansouri, B. (author), Poelma, R.H. (author), Zhang, G.Q. (author), van Zeijl, H.W. (author), Wei, J. (author)
This work describes the design, modelling and realisation of the mechanical part of a non-linear MEMS accelerometer intended for large displacement behaviour. For this, a mass/spring system was designed with an extremely low resonance frequency. In this work the mechanical behaviour was verified by measurements done using an optical setup,...
conference paper 2018
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Wicaksono, D.H.B. (author), Pandraud, G. (author), French, P.J. (author)
This paper presents an on-going work to develop micromachined silicon-based strain sensor inspired from the campaniform sensillum of insects. We present simple optical setup for the characterisation of a membrane-in-recess structure as an early stage in mimicking the natural sensor. The microstructure is a 500 nm-thick SiO2/SiN circular membrane...
conference paper 2005
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Middelburg, L.M. (author), el Mansouri, B. (author), van Zeijl, H.W. (author), Zhang, G.Q. (author), Poelma, R.H. (author)
In this work a method is described to investigate process variations across a wafer. Through wafer MEMS spiral resonators were designed, simulated, fabricated and characterized by measuring the eigenfrequency and corresponding mode shapes. Measuring the eigenfrequency and resulting spectral behavior of resonators on different locations on the...
conference paper 2017
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Wörhoff, Kerstin (author), Prak, Albert (author), Postma, F. (author), Leinse, A (author), Wu, K. (author), Peters, T.J. (author), Tichem, M. (author), Amaning-Appiah, B. (author), Renukappa, V. (author), Vollrath, G. (author), Balcells-Ventura, J. (author), Uhlig, P. (author), Seyfried, M. (author), Rose, D. (author), Santos, Raquel (author), Leijtens, XJM (author), Flintham, B. (author), Wale, M. (author), Robbins, D. (author)
Fully automated, high precision, cost-effective assembly technology for photonic packages remains one of the main challenges in photonic component manufacturing. Next to the cost aspect the most demanding assembly task for multiport photonic integrated circuits (PICs) is the high-precision (±0.1 μm) alignment and fixing required for optical I...
conference paper 2016
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Martins da Ponte, R. (author), Giagka, V. (author), Serdijn, W.A. (author)
This paper reports on the design and fabrication of a time-mode signal-processing in situ temperature sensor customized for an organ-on-a-chip (OOC) application. The circuit was fabricated using an in-house integrated circuit (IC) technology that requires only seven lithographic steps and is compatible with MEMS fabrication process. The...
conference paper 2018
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Wu, K. (author), Peters, T.J. (author), Tichem, M. (author), Postma, Ferry (author), Prak, Albert (author), Wörhoff, Kerstin (author), Leinse, Arne (author)
This paper proposes and tests a design of electro-thermal bimorph actuators for alignment of flexible photonic waveguides fabricated in 16 μm thick SiO<sup>2</sup>. The actuators are for use in a novel alignment concept for multi-port photonic integrated circuits (PICs), in which the fine alignment is taken care of by positioning of suspended...
conference paper 2016
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Smeets, E.M.J. (author), Bijnen, F.C.G. (author), Slabbekoorn, J. (author), Van Zeijl, H.W. (author)
In the MEMS world, increasing attention is being given to 3D devices requiring dual-sided processing. This requires lithography tools that are able to align a wafer to both its back side as front side. Overlay describes how well front and back side layers are positioned with respect to each other. Currently there is no simple and fast method to...
conference paper 2004
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Peters, T.J. (author), Tichem, M. (author)
This paper reports on the progress related to a multichannel photonic alignment concept, aiming for sub-micrometer precision in the alignment of the waveguides of two photonic integrated circuits (PICs). The concept consists of two steps: chip-to-chip positioning and chip bonding provide a coarse alignment after which waveguide-to-waveguide...
conference paper 2016
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Rajaraman, V. (author), Pakula, L.S. (author), Pham, H.T.M. (author), Sarro, P.M. (author), French, P.J. (author)
This paper presents a new low-cost, CMOS-compatible and robust wafer-level encapsulation technique developed using a stress-optimised PECVD SiC as the capping and sealing material, imparting harsh environment capability. This technique has been applied for the fabrication and encapsulation of a wide variety of surface- and thin-SOI...
conference paper 2009
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Rajaraman, V. (author), Makinwa, K.A.A. (author), French, P.J. (author)
We present a simple, flexible and low cost MEMS fabrication process, developed using deep reactive ion etching (DRIE) and wafer bonding technologies, for manufacturing in-plane high aspect ratio (HAR) inertial sensors. Among examples, the design and fabrication results of a two axis inertial device are presented. Fabricated device thickness...
conference paper 2008
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Wicaksono, D.H.B. (author)
New emerging sensing applications demand novel sensors in micro-/nano-scale to enable integration and embedding into higher level structures or systems. Downsizing the structure will usually decrease the sensitivity of the sensors, since the sensitivity is a function of geometrical parameters, e.g. mass in the case of inertial sensing, and...
doctoral thesis 2008
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Santagata, F. (author)
Many Micro-Electro-Mechanical-Systems (MEMS) require encapsulation, to prevent delicate sensor structures being exposed to external perturbations such as dust, humidity, touching, and gas pressure. An upcoming and cost-effective way of encapsulation is zero-level packaging or thin-film encapsulation. With this method, MEMS are already sealed...
doctoral thesis 2011
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Lau, G.K. (author)
Polymers can be used to constitute "artificial muscles" that actuate under an electric stimulus. These polymers include dielectric elastomers and thermally expandable polymers. They are insulating and relatively compliant. Their electric activation is enabled with integration of electrodes, heat conductors or heaters. However, the electrodes or...
doctoral thesis 2007
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Henneken, V.A. (author)
In this project, the technical feasibility of a novel assembly concept was explored, in which microsystem-based self-assembly functionality is added to an existing product. The case considered is the accurate alignment of an optical fibre relative to a telecommunication laser source. In the most demanding cases this requires alignment accuracies...
doctoral thesis 2008
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Farhadi Machekposhti, D. (author)
Classical human-engineered transmission mechanisms such as linkages, gears, and couplings are well established designs which made out of multiple parts and rigid hinges. However, these mechanisms impose disadvantages such as wear, friction, low precision and reliability, need for assembly and lubrications, and difficulty for miniaturization. By...
doctoral thesis 2018
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Shen, C. (author)
In this thesis we described a new approach to design, fabricate, package and test three silicon based porous vertical structures for nanoparticle separations. These vertical structures stand in between two microfluidic channels. In these walls nano channels that connect the two adjacent microchannels are embedded. Fluid and small particles can...
doctoral thesis 2011
Searched for: subject:"MEMS"
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