Searched for: subject:"MEMS"
(1 - 5 of 5)
document
Quiros Solano, W.F. (author), Gaio, N. (author), Silvestri, C. (author), Pandraud, G. (author), Dekker, R. (author), Sarro, P.M. (author)
Organ-on-chip (OOC) is becoming the alternative tool to conventional in vitro screening. Heart-on-chip devices including microstructures for mechanical and electrical stimulation have been demonstrated to be advantageous to study structural organization and maturation of heart cells. This paper presents the development of metal and polymeric...
journal article 2019
document
Estevez, P. (author), Bank, J. (author), Porta, M. (author), Wei, J. (author), Sarro, P.M. (author), Tichem, M. (author), Staufer, U. (author)
This paper presents the design, fabrication and characterization of a piezoresistive 6 Degrees of Freedom (DOF) force and torque sensor to be used in micro-manipulation. The mechanical structure of the device consists of 7 suspended beams and a calibration structure, which can be replaced by micro-manipulation tools such as micro-grippers or...
journal article 2011
document
Tran, A.T. (author), Pandraud, G. (author), Schellevis, H. (author), Alan, T. (author), Aravindh, V. (author), Wunnicke, O. (author), Sarro, P.M. (author)
Very thin piezoelectric cantilevers based on AlN layers using titanium Ti thin film electrodes are fabricated and characterized. By optimizing the Ti sputtering parameters, a very low stress (156 MPa) layers stack with high crystallinity and strong (002) orientation of the AlN films is obtained. Finally, a simple fabrication process, fully CMOS...
journal article 2011
document
Rajaraman, V. (author), Pakula, L.S. (author), Yang, H. (author), French, P.J. (author), Sarro, P.M. (author)
Attractive material properties of plasma enhanced chemical vapour deposited (PECVD) silicon carbide (SiC) when combined with CMOS-compatible low thermal budget processing provides an ideal technology platform for developing various microelectromechanical systems (MEMS) devices and merging them with integrated circuits. In this paper we present a...
journal article 2011
document
Rajaraman, V. (author), Pakula, L.S. (author), Pham, H.T.M. (author), Sarro, P.M. (author), French, P.J. (author)
This paper presents a new low-cost, CMOS-compatible and robust wafer-level encapsulation technique developed using a stress-optimised PECVD SiC as the capping and sealing material, imparting harsh environment capability. This technique has been applied for the fabrication and encapsulation of a wide variety of surface- and thin-SOI...
conference paper 2009
Searched for: subject:"MEMS"
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