Searched for: subject:"MEMS"
(1 - 20 of 65)

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Houtgast, E.J. (author), Sima, V.M. (author), Bertels, K.L.M. (author), Al-Ars, Z. (author)
We are rapidly entering the era of genomics. The dramatic cost reduction of DNA sequencing due to the introduction of Next Generation Sequencing (NGS) techniques has resulted in an exponential growth of genetics data. The amount of data generated, and its associated processing into useful information, poses serious computational challenges. Here...
abstract 2016
document
Wicaksono, D.H.B. (author), Pandraud, G. (author), French, P.J. (author)
This paper presents an on-going work to develop micromachined silicon-based strain sensor inspired from the campaniform sensillum of insects. We present simple optical setup for the characterisation of a membrane-in-recess structure as an early stage in mimicking the natural sensor. The microstructure is a 500 nm-thick SiO2/SiN circular membrane...
conference paper 2005
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Wörhoff, Kerstin (author), Prak, Albert (author), postma, F (author), Leinse, A (author), Wu, K. (author), Peters, T.J. (author), Tichem, M. (author), Amaning-Appiah, B. (author), Renukappa, V. (author), Vollrath, G. (author), Balcells-Ventura, J. (author), Uhlig, P. (author), Seyfried, M. (author), Rose, D. (author), Santos, Raquel (author), Leijtens, XJM (author), Flintham, B. (author), Wale, M. (author), Robbins, D. (author)
Fully automated, high precision, cost-effective assembly technology for photonic packages remains one of the main challenges in photonic component manufacturing. Next to the cost aspect the most demanding assembly task for multiport photonic integrated circuits (PICs) is the high-precision (±0.1 μm) alignment and fixing required for optical I...
conference paper 2016
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Pakula, L.S. (author), Rajaraman, V. (author), French, P.J. (author)
The operation principle, design, fabrication and measurement results of a quasi digital accelerometer fabricated on a thin silicon-on-insulator (SOI) substrate is presented. The accelerometer features quasi-digital output, therefore eliminating the need for analogue signal conditioning. The accelerometer can be directly interfaced to digital...
conference paper 2009
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Wu, K. (author), Peters, T.J. (author), Tichem, M. (author), Postma, Ferry (author), Prak, Albert (author), Wörhoff, Kerstin (author), Leinse, Arne (author)
This paper proposes and tests a design of electro-thermal bimorph actuators for alignment of flexible photonic waveguides fabricated in 16 μm thick SiO<sup>2</sup>. The actuators are for use in a novel alignment concept for multi-port photonic integrated circuits (PICs), in which the fine alignment is taken care of by positioning of suspended...
conference paper 2016
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Peters, T.J. (author), Tichem, M. (author)
This paper reports on the progress related to a multichannel photonic alignment concept, aiming for sub-micrometer precision in the alignment of the waveguides of two photonic integrated circuits (PICs). The concept consists of two steps: chip-to-chip positioning and chip bonding provide a coarse alignment after which waveguide-to-waveguide...
conference paper 2016
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Smeets, E.M.J. (author), Bijnen, F.C.G. (author), Slabbekoorn, J. (author), Van Zeijl, H.W. (author)
In the MEMS world, increasing attention is being given to 3D devices requiring dual-sided processing. This requires lithography tools that are able to align a wafer to both its back side as front side. Overlay describes how well front and back side layers are positioned with respect to each other. Currently there is no simple and fast method to...
conference paper 2004
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Rajaraman, V. (author), Pakula, L.S. (author), Pham, H.T.M. (author), Sarro, P.M. (author), French, P.J. (author)
This paper presents a new low-cost, CMOS-compatible and robust wafer-level encapsulation technique developed using a stress-optimised PECVD SiC as the capping and sealing material, imparting harsh environment capability. This technique has been applied for the fabrication and encapsulation of a wide variety of surface- and thin-SOI...
conference paper 2009
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Martins da Ponte, R. (author), Giagka, V. (author), Serdijn, W.A. (author)
This paper reports on the design and fabrication of a time-mode signal-processing in situ temperature sensor customized for an organ-on-a-chip (OOC) application. The circuit was fabricated using an in-house integrated circuit (IC) technology that requires only seven lithographic steps and is compatible with MEMS fabrication process. The...
conference paper 2018
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de Graaf, G. (author), Abarca Prouza, A.N. (author), Wolfenbuttel, R.F. (author)
Conventional thermal conductivity detectors (TCDs) demonstrate a flow dependence. The approach presented here to reduce the flow dependence is based on the on-line flow compensation using two thin-film sensors on membranes in parallel on the same chip that are differentially operated. These are laterally identically, but with a different depth...
conference paper 2015
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Middelburg, L.M. (author), el Mansouri, B. (author), van Zeijl, H.W. (author), Zhang, G.Q. (author), Poelma, René H. (author)
In this work a method is described to investigate process variations across a wafer. Through wafer MEMS spiral resonators were designed, simulated, fabricated and characterized by measuring the eigenfrequency and corresponding mode shapes. Measuring the eigenfrequency and resulting spectral behavior of resonators on different locations on the...
conference paper 2017
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Middelburg, L.M. (author), el Mansouri, B. (author), Poelma, René H. (author), Zhang, G.Q. (author), van Zeijl, H.W. (author), Wei, J. (author)
This work describes the design, modelling and realisation of the mechanical part of a non-linear MEMS accelerometer intended for large displacement behaviour. For this, a mass/spring system was designed with an extremely low resonance frequency. In this work the mechanical behaviour was verified by measurements done using an optical setup,...
conference paper 2018
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Rajaraman, V. (author), Makinwa, K.A.A. (author), French, P.J. (author)
We present a simple, flexible and low cost MEMS fabrication process, developed using deep reactive ion etching (DRIE) and wafer bonding technologies, for manufacturing in-plane high aspect ratio (HAR) inertial sensors. Among examples, the design and fabrication results of a two axis inertial device are presented. Fabricated device thickness...
conference paper 2008
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de Athayde Costa e Silva, M. (author), Cordeiro Guerrieri, D. (author), Cervone, A. (author)
This paper presents a dynamic system approach for the modeling of fluid flow in microchannels to be used in thrust control applications. A micro-resistojet fabricated using MEMS (Microelectromechanical Systems) technology has been selected for the analysis. The device operates by vaporizing a liquid propellant, in this case water, and expelling...
conference paper 2016
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Morana, B. (author)
doctoral thesis 2015
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Gurav, S.P. (author)
doctoral thesis 2005
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Shen, C. (author)
In this thesis we described a new approach to design, fabricate, package and test three silicon based porous vertical structures for nanoparticle separations. These vertical structures stand in between two microfluidic channels. In these walls nano channels that connect the two adjacent microchannels are embedded. Fluid and small particles can...
doctoral thesis 2011
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Wei, J. (author)
High-precision manipulation of small-size objects is an attractive and challenging topic for both industrial production and fundamental scientific research. The capability of monitoring micro-samples during handling is essential to the accuracy and efficiency of a handling system for both liquid and solid samples. When handling liquid samples...
doctoral thesis 2010
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Paalvast, S.L. (author)
The primary goal of this research was to study the feasibility of a thermal micro actuator for improved tracking performance of a Hard Disk Drive (HDD), and the feasibility of thermal actuation for precision micro motion and positioning in general. The fast dynamics of the micro actuator allows it to quickly correct position errors and thus...
doctoral thesis 2010
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Westra, H.J.R. (author)
In this Thesis, nonlinear dynamics and nonlinear interactions are studied from a micromechanical point of view. Single and doubly clamped beams are used as model systems where nonlinearity plays an important role. The nonlinearity also gives rise to rich dynamic behavior with phenomena like bifurcations, stochastic switching and amplitude...
doctoral thesis 2012
Searched for: subject:"MEMS"
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