Searched for: subject%3A%22MEMS%22
(1 - 4 of 4)
document
Peters, T.J. (author), Tichem, M. (author)
This paper proposes a microfabrication process for the reliable release of SiO2 beam structures. These structures are intended to be utilized in SiO2 photonic MEMS. A major fabrication challenge is the release of thick (>10 ?m) SiO2 structures with high yield. A single mask process is developed based on temporary reinforcement of the SiO2...
journal article 2015
document
Savov, A.M. (author), Joshi, S. (author), Shafqat, Salman (author), Hoefnagels, Johan (author), Louwerse, M.C. (author), Stoute, R. (author), Dekker, R. (author)
A device for studying the mechanical and electrical behavior of free-standing micro-fabricated metal structures, subjected to a very large deformation, is presented in this paper. The free-standing structures are intended to serve as interconnects in high-density, highly stretchable electronic circuits. For an easy, damage-free handling and...
journal article 2018
document
Wu, K. (author), Tichem, M. (author)
Photonic packaging, which includes high-precision assembly of photonic sub-systems, is currently a bottleneck in the development of commercially-available integrated photonic products. In the pursuit of a fully-automated, high-precision, and cost-effective photonic alignment scheme for two multi-channel photonic chips, this paper explores...
journal article 2018
document
Ahmad, T. (author), Al-Ars, Z. (author), Hofstee, H.P. (author)
Background Recently many new deep learning–based variant-calling methods like DeepVariant have emerged as more accurate compared with conventional variant-calling algorithms such as GATK HaplotypeCaller, Sterlka2, and Freebayes albeit at higher computational costs. Therefore, there is a need for more scalable and higher performance workflows of...
review 2021
Searched for: subject%3A%22MEMS%22
(1 - 4 of 4)