Searched for: subject:"MEMS"
(41 - 60 of 66)

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Zaal, J.J.M. (author)
The world has seen an unrivaled spread of semiconductor technology into virtually any part of society. The main enablers of this semiconductor rush are the decreasing feature size and the constantly decreasing costs of semiconductors. The decreasing costs of semiconductors in general are caused by the smaller feature size, the higher yield and...
doctoral thesis 2012
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Dias, R.A. (author), Macedo, P.J. (author), Silva, H.D. (author), Wolffenbuttel, R.F. (author), Cretu, E. (author), Rocha, L.A. (author)
A high-resolution, high dynamic range capacitive accelerometer based on pull-in time measurement is described in this paper. The high sensitivity of pull-in time can be used to implement high performance accelerometers, but non-linearity and low dynamic range compromise device performance. A closed-loop approach using an electrostatic actuation...
journal article 2012
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Yang, C.K. (author)
This thesis studies the effects of scaling on the characterisation and readout of micro-electro mechanical systems (MEMS) to nano-electro mechanical systems (NEMS). In particular it focuses on cantilever, which is a basic device building block and an important transducer in many sensing applications. This thesis presents an overview of major...
doctoral thesis 2012
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Rajaraman, V. (author), Sabageh, I. (author), French, P. (author), Pansraud, G. (author), Cretu, E. (author)
This work reports the design, modelling, fabrication and preliminary functionality testing of a dual-mass MEMS vibratory gyroscope for application in medical instrumentation, among others. The two-framed gyro has drive and sense mode resonance frequencies of 2500Hz and 2830Hz, with its bandwidth tunable between 40-330Hz. Adopted design and...
journal article 2011
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Estevez, P. (author), Bank, J. (author), Porta, M. (author), Wei, J. (author), Sarro, P.M. (author), Tichem, M. (author), Staufer, U. (author)
This paper presents the design, fabrication and characterization of a piezoresistive 6 Degrees of Freedom (DOF) force and torque sensor to be used in micro-manipulation. The mechanical structure of the device consists of 7 suspended beams and a calibration structure, which can be replaced by micro-manipulation tools such as micro-grippers or...
journal article 2011
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Santagata, F. (author)
Many Micro-Electro-Mechanical-Systems (MEMS) require encapsulation, to prevent delicate sensor structures being exposed to external perturbations such as dust, humidity, touching, and gas pressure. An upcoming and cost-effective way of encapsulation is zero-level packaging or thin-film encapsulation. With this method, MEMS are already sealed...
doctoral thesis 2011
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Shen, C. (author)
In this thesis we described a new approach to design, fabricate, package and test three silicon based porous vertical structures for nanoparticle separations. These vertical structures stand in between two microfluidic channels. In these walls nano channels that connect the two adjacent microchannels are embedded. Fluid and small particles can...
doctoral thesis 2011
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Dias, R.A. (author), Wolffenbuttel, R.F. (author), Cretu, E. (author), Rocha, L.A. (author)
The experimental evaluation of damping-improved parallel-plate geometries is reported in this paper. An improved damper geometry with air channels was developed to address contradictory design constraints: large sensing parallel-plate area is desirable for a significant readout capacitance as well as reduced damping coefficient. Damping...
journal article 2011
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Tran, A.T. (author), Pandraud, G. (author), Schellevis, H. (author), Alan, T. (author), Aravindh, V. (author), Wunnicke, O. (author), Sarro, P.M. (author)
Very thin piezoelectric cantilevers based on AlN layers using titanium Ti thin film electrodes are fabricated and characterized. By optimizing the Ti sputtering parameters, a very low stress (156 MPa) layers stack with high crystallinity and strong (002) orientation of the AlN films is obtained. Finally, a simple fabrication process, fully CMOS...
journal article 2011
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Mihailovic, M. (author)
This thesis explores the employment of monocrystalline silicon in microsystems as an active material for different thermal functions, such as heat generation and heat transfer by conduction. In chapter 1 applications that need thermal micro devices, micro heaters and micro heat exchangers, are briefly introduced. The shortcomings of commonly...
doctoral thesis 2011
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Rajaraman, V. (author), Pakula, L.S. (author), Yang, H. (author), French, P.J. (author), Sarro, P.M. (author)
Attractive material properties of plasma enhanced chemical vapour deposited (PECVD) silicon carbide (SiC) when combined with CMOS-compatible low thermal budget processing provides an ideal technology platform for developing various microelectromechanical systems (MEMS) devices and merging them with integrated circuits. In this paper we present a...
journal article 2011
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Rajaraman, V. (author), Hau, B.S. (author), Rocha, L.A. (author), French, P.J. (author), Makinwa, K.A.A. (author)
This work reports on the design and modeling of a new flexible contact-mode 1-DOF piezoresistive contact force and impacttime detector used for acceleration sensing in the time domain. The key advantages of the contact-mode detection mechanism are the use of simple readout circuitry, compactness, good linearity, scalability, and the potential to...
journal article 2010
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Hannot, S.D.A. (author)
Microsystems are very small sensors and actuators, manufactured with the same technology as computer chips. Well known applications of these machines are the acceleration sensors in the Wii game console and the iPhone. At the micrometer length scales of microsystems the physical forces behave different when compared to devices operating in the...
doctoral thesis 2010
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Wei, J. (author)
High-precision manipulation of small-size objects is an attractive and challenging topic for both industrial production and fundamental scientific research. The capability of monitoring micro-samples during handling is essential to the accuracy and efficiency of a handling system for both liquid and solid samples. When handling liquid samples...
doctoral thesis 2010
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Zaal, J.J.M. (author), Van Driel, W.D. (author), Zhang, G.Q. (author)
This paper discusses the assembly challenges considering the design and manufacturability of a Wafer Level Thin Film Package in MEMS applications. The assembly processes are discussed. The loads associated with these processes are illustrated and evaluated. Numerical calculations are combined with experimental observations in order to estimate...
journal article 2010
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Paalvast, S.L. (author)
The primary goal of this research was to study the feasibility of a thermal micro actuator for improved tracking performance of a Hard Disk Drive (HDD), and the feasibility of thermal actuation for precision micro motion and positioning in general. The fast dynamics of the micro actuator allows it to quickly correct position errors and thus...
doctoral thesis 2010
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Rajaraman, V. (author), Pakula, L.S. (author), Pham, H.T.M. (author), Sarro, P.M. (author), French, P.J. (author)
This paper presents a new low-cost, CMOS-compatible and robust wafer-level encapsulation technique developed using a stress-optimised PECVD SiC as the capping and sealing material, imparting harsh environment capability. This technique has been applied for the fabrication and encapsulation of a wide variety of surface- and thin-SOI...
conference paper 2009
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Pakula, L.S. (author), Rajaraman, V. (author), French, P.J. (author)
The operation principle, design, fabrication and measurement results of a quasi digital accelerometer fabricated on a thin silicon-on-insulator (SOI) substrate is presented. The accelerometer features quasi-digital output, therefore eliminating the need for analogue signal conditioning. The accelerometer can be directly interfaced to digital...
conference paper 2009
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Henneken, V.A. (author)
In this project, the technical feasibility of a novel assembly concept was explored, in which microsystem-based self-assembly functionality is added to an existing product. The case considered is the accurate alignment of an optical fibre relative to a telecommunication laser source. In the most demanding cases this requires alignment accuracies...
doctoral thesis 2008
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Wicaksono, D.H.B. (author)
New emerging sensing applications demand novel sensors in micro-/nano-scale to enable integration and embedding into higher level structures or systems. Downsizing the structure will usually decrease the sensitivity of the sensors, since the sensitivity is a function of geometrical parameters, e.g. mass in the case of inertial sensing, and...
doctoral thesis 2008
Searched for: subject:"MEMS"
(41 - 60 of 66)

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