Searched for: subject%3A%22Microelectronic%255C%2Bpackaging%22
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Herrmann, A. (author), van Soestbergen, M. (author), Erich, S. J.F. (author), van der Ven, L. G.J. (author), Huinink, H. P. (author), van Driel, W.D. (author), Mavinkurve, A. (author), De Buyl, F. (author), Adan, O. C.G. (author)
The risk of corrosion poses a challenge to meet the stringent reliability requirements of microelectronic devices that are used in harsh environments. Microelectronic devices are often encapsulated in polymer packaging materials, which protect them from corrosion. These polymers are, however, not completely hermetic and thus allow small...
journal article 2022
Yi, H. (author)
The rapid development of semiconductor industry in the past decades has reshaped the world tremendously and greatly changed people's lives. Two-dimensional (2D) down-sizing of semiconductor devices following the “Moore's law” for many years is now reaching its boundary conditions of further exponential growth and three-dimensional (3D)...
doctoral thesis 2020
Ma, X. (author)
This research aims at developing a knowledge based fast qualification method for moisture or thermally induced failure in microelectronic packages. Driven by the market competition and the need for shorter time to market, fast qualification tests are becoming more and more important for the industry. Qualifications are tests which are used in...
doctoral thesis 2011