Design and prototyping of high voltage switch for arbitrary waveform generator

Power Electronics in association with the high voltage technology has the potential to bring out new generation of electrification with well-integrated renewable resources. Various high voltage applications of power electronics include Solid State Transformers (SST), Photovoltaic Inverters (PV), and Shore-to-ship connections. A demand for faster...

The Sensor Roller: A Piezoelectric Energy Harvesting Roller in a Bearing for Self-Sustained IoT Sensors

With the high-speed development of the Internet of Things (IoT), powering such a massive number of wireless IoT sensors with chemical batteries become more and more unpractical. To make the IoT sensors self-sustained, Piezoelectric Energy Harvesting (PEH) technology provides an excellent solution to power the devices with a relatively long...

Genetic Algorithm–Assisted Design of Redistribution Layer Vias for a Fan-Out Panel-Level SiC MOSFET Power Module Packaging

A fan-out panel-level packaging (FOPLP) with an embedded redistribution layer (RDL) via interconnection reduces the size, thermal resistance, and parasitic inductance of power module packaging. In this study, the effect of the RDL via size on the reliability of a FOPLP SiC MOSFET power module was investigated. To improve the thermal management...

Hybrid Si/SiC Switch Modulation with Minimum SiC MOSFET Conduction in Grid Connected Voltage Source Converters

In this article, a hybrid Si/Si carbide (SiC) switch (HyS) modulation with minimum SiC MOSFET conduction (mcHyS) is experimentally characterized, so as to derive its conduction and switching performance. These are later used to derive a silicon (Si) area analytical model for the HyS configuration. The chip area model is used to benchmark the...

Design of an 11kW DC-DC Resonant Converter for EV Charging with a 150-1000V Output Voltage Range

The worldwide adoption of Electric Vehicles (EV) has gained momentum in recent years, with more than 30% of all EVs being sold last year. Additionally, a new trend of 800 V battery architectures has appeared to allow for faster charging than the now common 400 V architectures. Future proof charging topologies should, therefore, be able to...

A Transformer Isolated Driving Method for SiC MOSFETs with a Constant Negative Off Voltage

SiC MOSFETs have become more and more popular in recent years. Apart from its superior performance, attentions should be paid to its driving method. In this paper, an improved transformer driving circuit is proposed which can provide an almost constant negative turn-off voltage within a wide dutycycle range. Both simulation and experimental...

Design of a Fan-Out Panel-Level SiC MOSFET Power Module Using Ant Colony Optimization-Back Propagation Neural Network

A new panel-level silicon carbide (SiC) metal oxide semiconductor field effect transistor (MOSFET) power module was developed by using the fan-out and embedded chip technologies. To achieve the more effective thermal management and higher reliability under thermal cycling, a new optimization method called Ant colony optimization-back...

Modelling and Analysis of the Single-Phase Operation of the Belgian PFC Rectifier

Boost-type power factor correction (PFC) rectifiers can be used in, for example, battery charging systems for Electric Vehicles (EVs). Conventionally available three-phase PFC rectifiers are limited to output 1/3 of the rated power when connected to a single-phase mains. This work presents the research into the single-phase operation of the...

Belgian Rectifier: Analysis and Optimization of a Novel Three-Phase Boost-Type PFC Rectifier

This project investigates the newly proposed Belgian Rectifier, a novel three-phase boost power factor correction rectifier which is advantageous for AC-to-DC conversion in applications, such as, off-board and on-board chargers for electric vehicles. The Belgian rectifier can achieve very high levels of efficiency<br/>and power density, while...

Fan-Out SiC MOSFET Power Module in an Organic Substrate

Microchannel Thermal Management System with Two-Phase Flow for Power Electronics over 500 W/cm²Heat Dissipation

In this article, a microchannel thermal management system (MTMS) with the two-phase flow using the refrigerant R1234yf with low global warming potential is presented. The thermal test vehicles (TTVs) were made of either single or multiple thermal test chips embedded in the substrates, which were then attached to the MTMS. The system included...

Characterization of PCB Embedded Package Materials for SiC MOSFETs

In this paper, a novel fan-out panel-level printed circuit board (PCB) embedded package technology for silicon carbide (SiC) MOSFET power module is presented to address parasitic inductances, heat dissipation, and reliability issues that are inherent with aluminum wires used in conventional packaging scheme. To withstand high temperature...