Searched for: subject%3A%22Solder%255C+joint%255C+fatigue%255C+risk%255C+estimation%22
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Yuan, Cadmus (author), Fan, Xuejun (author), Zhang, Kouchi (author)
Solder joint fatigue is one of the critical failure modes in ball-grid array packaging. Because the reliability test is time-consuming and geometrical/material nonlinearities are required for the physics-driven model, the AI-assisted simulation framework is developed to establish the risk estimation capability against the design and process...
journal article 2021