Carbon nanotube based solutions for on-chip thermal management

The performances of microelectronic and optoelectronic devices are often severely limited by high temperatures and insufficient heat management. Therefore, when considering device fabrication and packaging, it is important to select materials based on their thermal performance. The increasing demand for more integrated functionality and...

Immediate Neighbourhood Temperature Adaptive Routing for Dynamically Throttled 3-D Networks-on-Chip

In this paper, we present the Immediate Neighbourhood Temperature (INT) routing algorithm which balances thermal profiles across dynamically-throttled 3D NoCs by adaptively routing interconnect traffic based on runtime temperature monitoring. INT avoids the overheads of system-wide temperature monitoring by relying on the heat transfer...

Physical Integration of a Photovoltaic-Battery System: A Thermal Analysis

Solar-battery systems are still expensive, bulky, and space consuming. To tackle these issues, we propose a novel device that combines all the components of a solar-battery system in one device. This device might help reduce installation cost compared to the current solar-battery systems as well as provide a plug-and-play solution. However, this...

Thermal management of High-Current Bidirectional Isolated DC-DC Converters

Thermal management of solid state lighting module

Solid-State Lighting (SSL), powered by Light-Emitting Diodes (LEDs), is an energy-efficient technology for lighting systems. In contrast to incandescent lights which obtain high efficiency at high temperatures, the highest efficiency of LEDs is reached at low temperatures. The thermal management in LED product is then a key design parameter as...

Novel manufacturing method for FRP composites with a multifunctional vascular network

Fibre reinforced polymer composite materials are becoming more widely adopted for high performance industrial applications. The hierarchical nature of these materials offers a unique opportunity to incorporate multi-functionality whilst maintaining their excellent mechanical properties. Ideally, multifunctional composites can be configured to...

Three-dimensional integration of power electronic converters on printed circuit board

The current construction technology for PCB assembled power converters is based on the assembly of pre-manufactured discrete components. Fundamental limits of this construction method are steadily being reached as power converters tend to exploit higher processing speeds to gain advantages in both magnetic component size and overall power...

Design techniques for thermal management in switch mode converters