Searched for: subject%3A%22WLP%22
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Sokolovskij, R. (author)
Solid State Lighting (SSL) is on track to replace conventional incandescent and fluorescent sources for general lighting. Even though it offers many benefits, the high initial device costs are still a major hindrance for many consumers. Packaging can account for up to half of the total device price, offering high potential for cost reduction. In...
master thesis 2013
Rajaraman, V. (author), Pakula, L.S. (author), Yang, H. (author), French, P.J. (author), Sarro, P.M. (author)
Attractive material properties of plasma enhanced chemical vapour deposited (PECVD) silicon carbide (SiC) when combined with CMOS-compatible low thermal budget processing provides an ideal technology platform for developing various microelectromechanical systems (MEMS) devices and merging them with integrated circuits. In this paper we present a...
journal article 2011
Rajaraman, V. (author), Pakula, L.S. (author), Pham, H.T.M. (author), Sarro, P.M. (author), French, P.J. (author)
This paper presents a new low-cost, CMOS-compatible and robust wafer-level encapsulation technique developed using a stress-optimised PECVD SiC as the capping and sealing material, imparting harsh environment capability. This technique has been applied for the fabrication and encapsulation of a wide variety of surface- and thin-SOI...
conference paper 2009