MMIC packaging using Flip-Chip technology at G band

Front-end Monolithic Microwave Integrated Circuits (MMICs) have recently become commercially available for frequencies above 100 GHz. However, achieving low-loss and broadband interconnections between the antenna and MMICs is challenging for integrated front ends at these frequencies. This thesis presents the characterization of a flip-chip...

H-band Quartz-Silicon Leaky-Wave Lens with Air-Bridge Interconnect to GaAs Front-End

Thanks to the large bandwidth availability, millimeter and sub-millimeter wave systems are getting more attractive to be used in a wide range of applications, such as high-resolution radar or high-speed communications. In this contribution, a new lens antenna in-package solution is presented for the H-band (220320 GHz), including a wideband...