Searched for: subject%3A%22conductivity%22
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Li, Wenyu (author), Chen, Wei (author), Jiang, Jing (author), Tang, H. (author), Fan, J. (author)
Double-sided packages for heat dissipation are an efficient thermal management mechanism for power semiconductor devices. A fan-out panel-level packaging (FOPLP), as one of the double-sided forms, exhibits excellent electro–thermal characteristics and provides low stray inductance and thermal resistance. Besides, the temperature at each point...
journal article 2023
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Li, Bin (author), Jiang, Peng (author), Zhai, Famin (author), Chen, Junhong (author), Bei, G. (author), Hou, Xinmei (author), Chou, Kuo Chih (author)
In this paper, the fabrication and thermal conductivity (TC) of water-based nanofluids using boron (B)-doped SiC as dispersions are reported. Doping B into the <i>β</i>-SiC phase leads to the shrinkage of the SiC lattice due to the substitution of Si atoms (0.134 nm radius) by smaller B atoms (0.095 nm radius). The presence of B in the SiC...
journal article 2018
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Jiang, Bo (author), Ghaderi, M. (author), Bossche, A. (author), Visser, Jaco H. (author), Wolffenbuttel, R.F. (author)
Thermal impedance spectroscopy has been investigated as a non-destructive technique to determine the composition of ternary mixtures of biofuels. The principle of the thermal conductivity detector has been extended for measuring both the thermal conductivity and the thermal capacity of biofuel in the range between 1 to 100 Hz, using an AC...
conference paper 2017