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Kluba, M.M. (author), Morana, B. (author), Savov, A.M. (author), van Zeijl, H.W. (author), Pandraud, G. (author), Dekker, R. (author)
We present a novel, wafer-based fabrication process that enables integration and assembly of electronic components, such as ASICs and decoupling capacitors, with flexible interconnects. The electronic components are fabricated in, or placed on precisely defined and closely-spaced silicon islands that are connected by interconnects embedded in...
journal article 2018