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Li, J. (author), Vollebregt, S. (author), Zhang, Y. (author), Shekhar, A. (author), May, Alexander (author), van Driel, W.D. (author), Zhang, Kouchi (author)Due to the deficient passivation of the interface between silicon carbide and silicon dioxide, the defect-induced capture and release of trapped charges triggered by external Bias Temperature Stress (BTS) leads to parameter shifts and degraded device performance. This study models the trap-induced transient current in silicon carbide metal-oxide...conference paper 2024
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Yuan, Cadmus (author), de Jong, S.D.M. (author), van Driel, W.D. (author)The demand for rapid advancement in AI, mobile and automotive markets is pushing the boundaries of electronic packaging, including heterogeneous integration, high-power packages, and large-die packaging. Against this backdrop, machine learning technologies emerge as dynamic tools for correlation building and classification, revolutionizing the...conference paper 2024
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Wang, Xinyue (author), Yang, Zhoudong (author), Zhang, Kouchi (author), Zhang, Jing (author), Liu, Pan (author)With the popularization of wide band-gap power modules in offshore wind power systems and water surface photovoltaic power stations, packaging materials face challenges of corrosion by salt, blended with high humidity. Copper-silver (Cu-Ag) composite sintered paste was proposed by researchers as a novel die-attach material for a lower cost...conference paper 2023
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Kabbara, N. (author), Mwangi, A.W. (author), Gibescu, Madeleine (author), Abedi, A. (author), Stefanov, Alexandru (author), Palensky, P. (author)As power system's operational technology converges with innovative information and communication technologies, the need for extensive resilience testing for scenarios covering the electrical grid, networking bottlenecks, as well as cyber security threats, become a necessity. This paper proposes a comprehensive, multi-disciplinary simulation...conference paper 2023
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van der Sande, Robin (author), Deshmukh, R.S. (author), Shekhar, A. (author), Bauer, P. (author)When operating a modular multilevel converter (MMC), a margin appears between the arm voltage and sum capacitor voltage corresponding to the power dependent ripple. This margin can be used to enhance the DC link voltage and increase the transfer capacity of an MMC-based distribution link while keeping the submodule (SM) stresses fixed....conference paper 2023
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Van Rijs, Samantha (author), Ercan, İlke (author), Vladimirescu, A. (author), Sebastiano, F. (author)Quantum computers process information stored in quantum bits (qubits), which must be controlled and read out by a traditional electronic interface. Co-designing and cooptimizing such a quantum-classical complex system requires efficient simulators to emulate the qubits and their interaction with classical electronics. For spin-qubit readout,...conference paper 2023
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Hesam Mahmoudi Nezhad, N. (author), Ghaffarian Niasar, M. (author), Hagen, C.W. (author), Kruit, P. (author)To design electron lens systems, applying a fully automated optimization routine has not yet been feasible, especially for the case where the optimization has many free variables of the lens system, such as all parameters that define the geometry of the lens electrodes and the voltage of each electrode. Hence, the study of the implementation of...conference paper 2023
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Hubers, Martijn (author), Gagic, Mladen (author), Shekhar, A. (author)The small, light-weight and modular Lunar rover must survive several earth days in harsh environment after its moon landing. Its power electronic system with integrated solar generation needs power for its mission and also to stay warm in very cold temperatures of the moon. This paper presents the design of the power electronic system of the...conference paper 2023
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Gonzalez-Longatt, Francisco (author), Rueda, José L. (author), Palensky, P. (author), Chamorro, Harold R. (author), Abdellah, Kouzou (author)Inverter-based generation (IBG) is critical in achieving a dependable and resilient electrical system while meeting the net-zero emission goal. The enormous integration of IBG tends to produce various issues, including reduced rotational inertia and reduced short circuit levels. Several scientific publications agree that the voltage source...conference paper 2022
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Gao, J.R. (author), Gan, Y. (author), Mirzaei, B. (author), Silva, J. R.G. (author), Cherednichenko, S. (author)Heterodyne receivers combining a NbN HEB mixer with a local oscillator (LO) are the work horse for high resolution (≥106) spectroscopic observations at supra-terahertz frequencies. We report an MgB2 HEB mixer working at 5.3 THz with<br/>20 K operation temperature based on a previously published paper [Y. Gan et al, Appl. Phys. Lett., 119, 202601...conference paper 2022
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Qin, Z. (author), Wang, L. (author), Bauer, P. (author)Electric vehicles (EVs) are playing a crucial role in achieving the carbon neutral goal. To make the charging experience comparable with the refueling of the gasoline cars, more and more chargers are installed and connected to the grid. Meanwhile, the charging power is going up. As a result, more and more power quality issues associated with EV...conference paper 2022
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Martin, H.A. (author), Sattari, R. (author), Smits, E.C.P. (author), van Zeijl, H.W. (author), van Driel, W.D. (author), Zhang, Kouchi (author)With an increasing demand for high-power electronics, the need to meet stringent automotive norms and better understand the critical failure mechanisms are crucial in order to improve their reliablity. To that end, we developed an in-situ reliability monitoring setup capable of actively measuring the thermal performance of the package during...conference paper 2022
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Wang, Xinyue (author), Zeng, Zejun (author), Zhang, Jing (author), Zhang, Kouchi (author), Liu, Pan (author)With the increasing application of wide bandgap materials such as silicon carbide and gallium nitride in power devices, the working temperature of power devices has been pushed further. Therefore, it brings higher requirements for packaging materials. Sintered silver is a widely accepted chip connection material. However, silver suffers from...conference paper 2022
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van Ginkel, H.J. (author), Orvietani, M. (author), Romijn, J. (author), Zhang, Kouchi (author), Vollebregt, S. (author)In this work, a novel microfabrication-compatible production process is demonstrated and used to fabricate UV photoresistors made from ZnO nanoparticles. It comprises a simple room-temperature production method for synthesizing and direct-writing nanoparticles. The method can be used on a wide range of surfaces and print a wide range of...conference paper 2022
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Deshmukh, R.S. (author), Shekhar, A. (author), Bauer, P. (author)Electrolysis holds tremendous potential in reducing the carbon footprint and providing energy dense fuels such as methane. Such systems can be integrated with renewable energy systems with the aid of power electronics interfaces. However, this integration is not straight-forward and imposes various converter design challenges. This paper...conference paper 2022
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Gao, Hanyan (author), Zhang, Jing (author), Zhu, Yingcan (author), Guo, Ruiqian (author), Zhang, Wanlu (author), Zhang, Kouchi (author), Liu, Pan (author)With the trend of miniaturization and the increasing power density, the operating temperature of electronic devices keeps climbing, especially for wide band-gap semiconductors such as silicon carbide and gallium nitride. The high operating temperature up to 250℃ brings challenges to encapsulation materials since traditional encapsulation...conference paper 2022
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Yadav, S. (author), Qin, Z. (author), Bauer, P. (author)Balancing converters are an integral part of a bipolar dc grid. Resonant converter topologies are interesting for power electronics engineers due to their soft switching capabilities. A series resonant converter topology is promising as a balancing converter in a bipolar dc grid. The series resonant converter is usually a non-inverting...conference paper 2022
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Aarnoudse, Leontine (author), Kon, Johan (author), Classens, Koen (author), van Meer, Max (author), Poot, Maurice (author), Tacx, Paul (author), Strijbosch, Nard (author), Oomen, T.A.E. (author)Cross-coupled iterative learning control (ILC) can achieve high performance for manufacturing applications in which tracking a contour is essential for the quality of a product. The aim of this paper is to develop a framework for norm-optimal cross-coupled ILC that enables the use of exact contour errors that are calculated offline, and...conference paper 2022
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van Ginkel, H.J. (author), Romijn, J. (author), Vollebregt, S. (author), Zhang, Kouchi (author)The growing diversity in the used materials in semiconductor packaging provides challenges for achieving good interconnection. Particularly the very soft substrates, such as paper and polymers, and very hard, such as silicon carbide, offer unique challenges to wire-bonding or formation of vertical interconnects. Complementary technologies are...conference paper 2021
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Flipsen, Bas (author), Bakker, C.A. (author), de Pauw, I.C. (author)Designing products for the Circular Economy requires closing and slowing of loops by means of repair, reman-ufacturing, refurbishment, parts reuse and/or recycling. Ease of product disassembly facilitates these processes to be more cost-effective, resulting in a better circular strategy fit. In this paper we present the Hotspot Map-ping method....conference paper 2020