Multi Physics Simulation of Wafer Bonding with Nano Copper Paste

The significance of wafer bonding is fundamental to the progression of electronic systems. Common fabrication techniques for Cu pillars play a crucial role in establishing resilient and efficient interconnects within semiconductor devices. It is imperative to explore the potential of nano-copper as an alternative material to overcome limitations...

Simulation for stability of a beam-mass based high-resolution MEMS gravimeter

In this paper, stability and mechanistic simulations for a four-beam-mass-based MEMS gravimeter were conducted, and guidelines for the gravimeter design were proposed. Based on a prototyped MEMS device, the nonlinear finite element model was validated first against the experimental results. Then, we demonstrated three different scenarios in...

Practical aspects of thermomechanical modeling in electronics packaging: A case study with a SiC power package

In this paper, we presented several practical aspects for building robust and reliable finite element models in thermomechanical modeling in electronics packaging using finite element analysis. Firstly, for layered or patterned structures, a homogenized equivalent model, with equivalent orthotropic material properties, gives excellent...

Local Buckling Analysis of Thin-Wall Shell Structures

This master thesis presents research into buckling of thin hyperboloid shells structures. This type of structure is typically applied as the large cooling towers at coal fired electricity plants. However, modelling cooling towers is not the objective of this research. The objective of this research is to understand the buckling behaviour of...