Searched for: subject%3A%22flexible%255C+interconnect%22
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document
Kluba, M.M. (author)
The progress in the field of neurostimulation is impressive, both from a technical as well as from a therapeutic point of view. Nowadays, the electrical stimulation of the nervous system can be used to induce or suppress muscle responses. Additionally, it can also influence hearing, vision, immune system response, pain perception, and even...
doctoral thesis 2022
document
Liu, Pan (author), Li, J. (author), van Zeijl, H.W. (author), Zhang, Kouchi (author)
A polymer-based wafer level integration technology suitable for miniaturized and multi-functional systems integration was developed and demonstrated in this work. Wafer scale flexible interconnects were firstly fabricated on one wafer, and then transferred to another wafer. Such transfer process involved wafer bonding and application of...
conference paper 2020
document
Kluba, M.M. (author), Morana, B. (author), Savov, A.M. (author), van Zeijl, H.W. (author), Pandraud, G. (author), Dekker, R. (author)
We present a novel, wafer-based fabrication process that enables integration and assembly of electronic components, such as ASICs and decoupling capacitors, with flexible interconnects. The electronic components are fabricated in, or placed on precisely defined and closely-spaced silicon islands that are connected by interconnects embedded in...
journal article 2018
document
Li, J. (author)
System in a package (SIP) allows integrated circuit (ICs) modules or other components from different suppliers and technologies to be integrated into highly functional products. This SIP could realize miniaturized and multifunctional systems enabling emerging technologies like solid-state lightening (SSL), internet of things (IOT), etc. Due to...
master thesis 2015
Searched for: subject%3A%22flexible%255C+interconnect%22
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