Data Background-Based Test Development for All Interconnect and Contact Defects in RRAMs

Resistive Random Access Memory (RRAM) is a potential technology to replace conventional memories by providing low power consumption and high-density storage. As various manufacturing vendors make significant efforts to push it to high-volume production and commercialization, high-quality and efficient test solutions are of great importance. This...

Low Temperature Fine Pitch All-Copper Interconnects Combining Photopatternable Underfill Films

The trend to 3D and heterogeneous integration enable driving multi-functional blocks in one package. Flip-chip integration is currently playing an important role and is based on solder joints. To overcome the limitations of solder joints, all-copper interconnects have been investigated to meet electrical, thermal, and reliability demands in...

Hierarchical Cyber-Attack Detection in Large-Scale Interconnected Systems

In this paper we present a hierarchical scheme to detect cyber-attacks in a hierarchical control architecture for large-scale interconnected systems (LSS). We consider the LSS as a network of physically coupled subsystems, equipped with a two-layer controller: on the local level, decentralized controllers guarantee overall stability and...

Energy analysis of a Hybrid Wind-Wave Solution for Remote Islands

The energy needs of most Aegean islands are covered by the operation of autonomous/local power stations (APS/LPS) using imported oil. The costly operation of the APS/LPS combined with the resulting environmental problems, set the issue of a sustainable and rational energy solution mainly for the remote islands, showing respect to the sensitive...

High Step Coverage Interconnects By Printed Nanoparticles

The growing diversity in the used materials in semiconductor packaging provides challenges for achieving good interconnection. Particularly the very soft substrates, such as paper and polymers, and very hard, such as silicon carbide, offer unique challenges to wire-bonding or formation of vertical interconnects. Complementary technologies are...

Design of Multivariable PI Controller Using Evolutionary Algorithms for VSP based AC/DC Interconnected Systems

A new application of Multivariable Proportional-Integral (MPI) controller with using evolutionary algorithms for a VSP based AC/DC interconnected power system model is proposed. The VSP based HVDC model is added for mitigation of system frequency dynamics by emulating virtual inertia. The designed heuristic-based multivariable PI controller is...

Wafer Scale Flexible Interconnect Transfer for Hetrogeneous Integration

A polymer-based wafer level integration technology suitable for miniaturized and multi-functional systems integration was developed and demonstrated in this work. Wafer scale flexible interconnects were firstly fabricated on one wafer, and then transferred to another wafer. Such transfer process involved wafer bonding and application of...

3D interconnect technology based on low temperature copper nanoparticle sintering

We explore a methodology for patterned copper nanoparticle paste for 3D interconnect applications in wafer to wafer (W2W) bonding. A novel fine pitch thermal compression bonding process (sintering) with coated copper nanoparticle paste was developed. Most of the particle size is between 10-30 nm. Lithographically defined stencil printing using...

On-chip positionable photonic waveguides for chip-to-chip optical interconnects

This paper reports on the progress related to a multichannel photonic alignment concept, aiming for sub-micrometer precision in the alignment of the waveguides of two photonic integrated circuits (PICs). The concept consists of two steps: chip-to-chip positioning and chip bonding provide a coarse alignment after which waveguide-to-waveguide...

Positioning More Than Moore Characterization Needs and Methods within the 2011 ITRS

The concept “More than Moore” was introduced in the 2005 edition of the International Technology Roadmap for Semiconductors (ITRS), with the purpose to describe technology features that do not fit the miniaturization trends as implied by Moore's Law. These features typically enable non?digital functionalities, such as wireless communication,...

Distributed control applied to combined electricity and natural gas infrastructures

The optimization of combined electricity and natural gas systems is addressed in this paper. The two networks are connected via energy hubs. Using the energy hub concept, the interactions between the different infrastructures can be analyzed. A system consisting of several interconnected hubs forms a distributed power generation structure where...

Multi-area control of overlapping areas in power systems for FACTS control

As power systems generally are large interconnected systems controlled by several parties, centralized optimal power flow (OPF) control taking the entire grid into account is often not feasible. To use optimal control in power systems nevertheless, the overall system is decomposed into areas with associated subproblems, which are solved in an...