Searched for: subject:"interconnects"
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Spyridon, Trikalitis (author), Lavidas, G. (author), Kaldellis, John K (author)
The energy needs of most Aegean islands are covered by the operation of autonomous/local power stations (APS/LPS) using imported oil. The costly operation of the APS/LPS combined with the resulting environmental problems, set the issue of a sustainable and rational energy solution mainly for the remote islands, showing respect to the sensitive...
conference paper 2021
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Hari, S. (author), Trompenaars, P. H.F. (author), Mulders, J. J.L. (author), Kruit, P. (author), Hagen, C.W. (author)
High resolution dense lines patterned by focused electron beam-induced deposition (FEBID) have been demonstrated to be promising for lithography. One of the challenges is the presence of interconnecting material, which is often carbonaceous, between the lines as a result of the Gaussian line profile. We demonstrate the use of focused electron...
journal article 2021
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Alfaro Barrantes, J.A. (author), Mastrangeli, M. (author), Thoen, David (author), Visser, Sten (author), Bueno Lopez, J. (author), Baselmans, J.J.A. (author), Sarro, Pasqualina M (author)
This paper describes the microfabrication and electrical characterization of aluminum-coated superconducting through-silicon vias (TSVs) with sharp superconducting transition above 1 K. The sharp superconducting transition was achieved by means of fully conformal and void-free DC-sputtering of the TSVs with Al, and is here demonstrated in up...
journal article 2021
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Ye, J. (author), Reppa, V. (author), Godjevac, M. (author), Negenborn, R.R. (author)
Offshore platforms and windmills are constructed by assembling huge mechanical structures transported by heavy lift vessels. The construction process comprises two interconnected operations, the dynamic positioning (DP) of the vessel and the lifting of heavy loads. The DP system is commonly designed and tuned for the case that there is no...
journal article 2021
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Cai, Zhi (author)
The thesis clarifies the graduation project for the master program of Integrated Product Design at the Delft University of Technology. It describes an interconnection method to connect electronics onto the smart textiles that differs from any solutions existing in the market. Smart textiles are considered as the future of the clothes and are...
master thesis 2020
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Dalla Pozza, Gilberto (author)
Comparative study on the necessary upgrade in European interconnections to sustain solar and wind sources uptake in the energy mix. Grid Development for most difficult borders, and planning recommendations, to reach Paris compatible scenario by 2040.
master thesis 2020
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Pico Parra, Mauricio (author)
Infrastructure asset managers have the increasing challenge not only to maintain efficiently the functionalities and quality of their infrastructures, but also to upgrade them for the increasing demands and to achieve added value to their assets (Hertogh, Bakker, van der Vlist, & Barneveld, 2018). Moreover, infrastructure projects in densely...
master thesis 2020
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Alfaro Barrantes, J.A. (author), Mastrangeli, M. (author), Thoen, David (author), Visser, Sven (author), Bueno Lopez, J. (author), Baselmans, J.J.A. (author), Sarro, Pasqualina M (author)
This paper presents the fabrication and electrical characterization of superconducting high-aspect ratio through-silicon vias DC-sputtered with aluminum. Fully conformal and void-free coating of 300 μm-deep and 50 μmwide vias with Al, a CMOS-compatible and widely available superconductor, was made possible by tailoring a funneled sidewall...
journal article 2020
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Yi, H. (author)
The rapid development of semiconductor industry in the past decades has reshaped the world tremendously and greatly changed people's lives. Two-dimensional (2D) down-sizing of semiconductor devices following the “Moore's law” for many years is now reaching its boundary conditions of further exponential growth and three-dimensional (3D)...
doctoral thesis 2020
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Pan, K. (author), Dong, J. (author), Rakhshani, E. (author), Palensky, P. (author)
The high penetration of renewable energy resources and power electronic-based components has led to a low-inertia power grid which would bring challenges to system operations. The new model of load frequency control (LFC) must be able to handle the modern scenario where controlled areas are interconnected by parallel AC/HVDC links and storage...
journal article 2020
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Liu, Pan (author), Li, J. (author), van Zeijl, H.W. (author), Zhang, Kouchi (author)
A polymer-based wafer level integration technology suitable for miniaturized and multi-functional systems integration was developed and demonstrated in this work. Wafer scale flexible interconnects were firstly fabricated on one wafer, and then transferred to another wafer. Such transfer process involved wafer bonding and application of...
conference paper 2020
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Miranda Castillo, María (author)
The uncertainties of the current power system with a larger share of renewables and more volatile generation profiles increases the importance of assessing resource adequacy. Within this framework, the thesis “Evaluation of missing capacity and resource adequacy in an interconnected power system” aims to answer the following question: “How to...
master thesis 2019
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Raaphorst, Berend (author)
Vacancy is and remains a serious problem in today's office landscape. Many spaces and buildings are unable to adapt to the modern knowledge economy is shifting towards. This project attempts to provide a solution for disconnected, vacant offices spaces, particularly through the integration of parametric architecture. The redevelopment of the...
master thesis 2019
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Koppes, Fabian (author)
Land scarcity is increasing and therefore one of the main challenges for renewable energy in the future is ‘physical space’. While renewables need a lot of space compared to conventional energy sources, and the competition for space is already increasing (food production, housing etc.), leading to higher land costs and opposition. Public...
master thesis 2019
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Joshi, S. (author)
Advancements in stretchable electronic systems have changed the way modern electronics interact with their target systems, by their conformability to more complex shapes as compared to conventional rigid or flexible electronics. By utilizing this, limitless applications in the field of healthcare can be realized, such as wearable and implantable...
doctoral thesis 2018
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Kopally, Hima (author)
Wirebonding is an interconnection technology used to connect a chip to its LED package. It is currently not well understood which wirebond characteristics are best to tailor to prevent the failure of wirebonds. The focus of this thesis is to understand the physics-of-failure of wirebonds via an experimental approach. Therefore, an experimental...
master thesis 2018
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Torres, Patricio (author), van Wingerden, J.W. (author)
In this paper, a new identification method for large 2D grids of interconnected systems is presented. The proposed algorithm minimizes the Output-Error of the lifted system by using a Steepest-Descent optimization method which exploit the Multilevel Sequentially-Semi Separable (MSSS) structure of the involved matrices. Furthermore, it is...
journal article 2018
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Savov, A.M. (author), Joshi, S. (author), Shafqat, Salman (author), Hoefnagels, Johan (author), Louwerse, M.C. (author), Stoute, R. (author), Dekker, R. (author)
A device for studying the mechanical and electrical behavior of free-standing micro-fabricated metal structures, subjected to a very large deformation, is presented in this paper. The free-standing structures are intended to serve as interconnects in high-density, highly stretchable electronic circuits. For an easy, damage-free handling and...
journal article 2018
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Kluba, M.M. (author), Morana, B. (author), Savov, A.M. (author), van Zeijl, H.W. (author), Pandraud, G. (author), Dekker, R. (author)
We present a novel, wafer-based fabrication process that enables integration and assembly of electronic components, such as ASICs and decoupling capacitors, with flexible interconnects. The electronic components are fabricated in, or placed on precisely defined and closely-spaced silicon islands that are connected by interconnects embedded in...
journal article 2018
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Rueda, Diego F. (author), Calle, Eusebi (author), Wang, X. (author), Kooij, R.E. (author)
Interconnection between telecommunication networks and other critical infrastructures is usually established through nodes that are spatially close, generating a geographical interdependency. Previous work has shown that in general, geographically interdependent networks are more robust with respect to cascading failures when the...
journal article 2018
Searched for: subject:"interconnects"
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