High aspect ratio surface micro-machining using carbon nanotubes

Silicon-based MEMS technology has been the standard for developing 2D and 3D<br/>micro-structures for many years. There are 2 main classifications of MEMS manufacturing technologies, viz. bulk micro-machining, and surface micro-machining.<br/>These techniques have its own set of drawbacks. Bulk micro-machining affects the structural integrity of...

An Axial Array for Volumetric Intravascular Ultrasound Imaging

Intravascular ultrasound (IVUS) is a medical imaging modality aimed at imaging blood vessel walls from within the vessel. Current commercial IVUS catheters are designed to yield two-dimensional cross-sectional images perpendicular to the vessel wall. By pulling the catheter back through the artery (in the ‘axial direction’), and stacking the...

Characterization of waferstepper and process related front- to backwafer overlay errors in bulk micro machining using electrical overlay test structures

To validate the Front- To Backwafer Alignment (FTBA) calibration and to investigate process related overlay errors, electrical overlay test structures are used that requires FTBA [1]. Anisotropic KOH etch through the wafer is applied to transfer the backwafer pattern to the frontwafer. Consequently, the crystal orientation introduces an overlay...