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Herrmann, A. (author), van Soestbergen, M. (author), Erich, S. J.F. (author), van der Ven, L. G.J. (author), Huinink, H. P. (author), van Driel, W.D. (author), Mavinkurve, A. (author), De Buyl, F. (author), Adan, O. C.G. (author)The risk of corrosion poses a challenge to meet the stringent reliability requirements of microelectronic devices that are used in harsh environments. Microelectronic devices are often encapsulated in polymer packaging materials, which protect them from corrosion. These polymers are, however, not completely hermetic and thus allow small...journal article 2022
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Yi, H. (author)The rapid development of semiconductor industry in the past decades has reshaped the world tremendously and greatly changed people's lives. Two-dimensional (2D) down-sizing of semiconductor devices following the “Moore's law” for many years is now reaching its boundary conditions of further exponential growth and three-dimensional (3D)...doctoral thesis 2020
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Geel, Patrick (author), Kleijweg, Zep (author)This project is to design and implement a reconfigurable measurement interface for Internet of Things sensors, for the Microelectronics Department of the Delft University of Technology. This thesis will discuss the functionality and design process taken in designing such a reconfigurable measurement interface, focusing on generating signals and...bachelor thesis 2019
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Porret, C. (author), Hikavyy, A. (author), Granados, J. F.Gomez (author), Baudot, S. (author), Vohra, A. (author), Kunert, B. (author), Douhard, B. (author), Sammak, A. (author), Scappucci, G. (author)As CMOS scaling proceeds with sub-10 nm nodes, new architectures and materials are implemented to continue increasing performances at constant footprint. Strained and stacked channels and 3D-integrated devices have for instance been introduced for this purpose. A common requirement for these new technologies is a strict limitation in thermal...journal article 2019
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Cui, Z. (author), Chen, Xianping (author), Fan, Xuejun (author), Zhang, Kouchi (author)Interfacial properties of Cu/SiO2 in semiconductor devices has continued to be the subject of challenging study for many years because of its difficulties in experimentally quantifying the critical strength of interface. In this paper, a multi-scale modeling approach is built to characterize the interfacial properties between Cu and SiO2. In...conference paper 2018
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Chen, Liangbiao (author), Zhou, Jiang (author), Chu, Hsing-wei (author), Zhang, Kouchi (author), Fan, Xuejun (author)While moisture diffusion in microelectronic device and packaging has been studied for decades, the problems involving complex nonlinear moisture diffusion in multi-material assembly have not been fully studied. This paper has developed a general nonlinear diffusion model by adopting water activity, a continuous state variable, as the field...journal article 2017
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Didden, A. (author), Hillebrand, P. (author), Wollgarten, M. (author), Dam, B. (author), Van de Krol, R. (author)Conductive TiN shells have been deposited on SiO2 nanoparticles (10–20 nm primary particle size) with fluidized bed atomic layer deposition using TDMAT and NH3 as precursors. Analysis of the powders confirms that shell growth saturates at approximately 0.4 nm/cycle at TDMAT doses of >1.2 mmol/g of powder. TEM and XPS analysis showed that all...journal article 2016
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Xiao, A. (author)Due to the fact that microelectronics is made up from various materials with highly dissimilar thermo-mechanical properties, generally the interface between two adjacent materials is the place where delamination related failure most likely would occur. Failure of these interfaces results in decreased reliability and loss of performance of...doctoral thesis 2012
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Ma, X. (author)This research aims at developing a knowledge based fast qualification method for moisture or thermally induced failure in microelectronic packages. Driven by the market competition and the need for shorter time to market, fast qualification tests are becoming more and more important for the industry. Qualifications are tests which are used in...doctoral thesis 2011
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Böker, N.T. (author)Cardiotoxicity is a common side-effect of drugs and a major cause of late-stage drug rejections, costing the pharmaceutical companies massive amounts of money. A drug is cardiotoxic when it has a negative influence on the heart. Often, it changes the electrophysiological characteristics of the heart, resulting in arrhythmia. This can have...master thesis 2009
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Van Driel, W.D. (author)Microelectronics have pervaded our lives for the past fifty years, with massive penetration into health, mobility, safety and security, communications, education, entertainment and virtually every aspect of human lives. The main technology drivers that enabled this expansion are miniaturization and integration. The combination of these two has...doctoral thesis 2007