Understand the Physics of Solder Joint Degradation in Board Level Reliability Vibration and Thermal Cycle Test

Board-level reliability (BLR) looks at the reliability problem in the package and PCB interconnection, which is an important topic in microelectronics. The current criterion in the BLR test is to look if the connection is open, which can only detect the failure and there is no available method that can detect the degradation of the solder joints...

Interfacial properties of Cu/SiO2 using a multiscale modelling approach in electronic packages

Interfacial properties of Cu/SiO2 in semiconductor devices has continued to be the subject of challenging study for many years because of its difficulties in experimentally quantifying the critical strength of interface. In this paper, a multi-scale modeling approach is built to characterize the interfacial properties between Cu and SiO2. In...

Modeling nonlinear moisture diffusion in inhomogeneous media

While moisture diffusion in microelectronic device and packaging has been studied for decades, the problems involving complex nonlinear moisture diffusion in multi-material assembly have not been fully studied. This paper has developed a general nonlinear diffusion model by adopting water activity, a continuous state variable, as the field...