Searched for: subject:"miniaturization"
(1 - 8 of 8)
document
Sadeghian Marnani, H. (author), Van den Dool, T.C. (author), Crowcombe, W.E. (author), Herfst, R.W. (author), Winters, J. (author), Kramer, G.F.I.J. (author), Koster, N.B. (author)
With the device dimensions moving towards the 1X node, the semiconductor industry is rapidly approaching the point where 10 nm defects become critical. Therefore, new methods for improving the yield are emerging, including inspection and review methods with sufficient resolution and throughput. Existing industrial tools cannot anymore fulfill...
conference paper 2014
document
Yu, Z. (author)
This thesis describes the design of a front-end application-specific integrated circuit (ASIC), which will be put into the tip of a miniature ultrasound probe for 3D Trans-Esophageal Echocardiography (TEE). To enable 3D TEE, a matrix piezoelectric ultrasound transducer with more than 2000 elements will be used. Since a gastroscopic tube cannot...
doctoral thesis 2012
document
Laugere, F.P.J. (author)
doctoral thesis 2003
document
Van Guijt, R.M. (author)
doctoral thesis 2003
document
Moumen, A. (author)
doctoral thesis 2001
document
Verhoeven, H.J. (author)
doctoral thesis 1996
document
van Kampen, R.P. (author)
doctoral thesis 1995
document
Kwa, T.A. (author)
doctoral thesis 1995
Searched for: subject:"miniaturization"
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