From Si Towards SiC Technology for Harsh Environment Sensing

In the coming decade, the development in the area of More than Moore will certainly take over from Moore’s Law. Sensor development and sensor integration will prevail above lower node development. New packaging solutions will be developed which will fuel the integration of sensors. These developments can still be silicon based but where harsh...

Ultraviolet Sensing in WBG: SiC

Nowadays many applications require optical detection of some sorts, ranging from civil to military fields. Depending on the optical source, each sensing element needs to have distinct properties with the spectral range at the top. Choices such as sensitivity and environment play an equally important role, if not more important. The properties of...

Foldable 3D Wafer Level SSL Package Using Flexible Interconnect

Solid State Lighting (SSL) is on track to replace conventional incandescent and fluorescent sources for general lighting. Even though it offers many benefits, the high initial device costs are still a major hindrance for many consumers. Packaging can account for up to half of the total device price, offering high potential for cost reduction. In...