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Low Temperature Wafer Bonding Based on Copper Nanoparticle Sintering for 3D Interconnect FabricationDamian, A. (author)The current thesis is organized into 7 chapters. Chapter 1 offers a brief overview of the current research work and presents the project objectives, report structure and the relevant 3D integration challenges . The introductory section 1.1 provides the motivation for the current work by matching the current requirements in 3D integration with...master thesis 2013