Searched for: subject%3A%22nanoparticles%22
(1 - 6 of 6)
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Hu, D. (author), Du, L. (author), Alfreider, Markus (author), Fan, J. (author), Kiener, Daniel (author), Zhang, Kouchi (author)
To fulfill the high-temperature application requirement of high-power electronics packaging, Cu nanoparticle sintering technology, with benefits in low-temperature processing and high-melting point, has attracted considerable attention as a promising candidate for the die-attach interconnect. Comprehensive mechanical characterization of the...
journal article 2024
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Hu, D. (author), Qian, Cheng (author), Liu, X. (author), Du, L. (author), Sun, Zhongchao (author), Fan, X. (author), Zhang, Kouchi (author), Fan, J. (author)
As a promising technology for high-power and high-temperature power electronics packaging, nanocopper (nanoCu) paste sintering has recently received increasing attention as a die-attachment. The high-temperature deformation of sintered nanoCu paste and its underlying mechanisms challenge the reliability of high-power electronics packaging. In...
journal article 2023
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Hu, D. (author), Li, Z. (author), Fan, J. (author), Zhang, Kouchi (author)
As a critical part of speeding up industrial electrification, power electronics, and its packaging technology are undergoing rapid development. Cu nanoparticle sintering technology has therefore received extensive attention for its excellent performance in the die-attachment layer, where the mechanical properties are essential to be known for...
conference paper 2023
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Hu, D. (author), Shah, M.B. (author), Fan, J. (author), Vollebregt, S. (author), Zhang, Kouchi (author)
Driving by the increased demand for hermetic packaging in the more than Moore (MtM) roadmap, a Cu nanoparticle sintering-enabled hermetic sealing solution was developed with a small-size sealing ring. The developed technology simplifies microfabrication and requires less surface roughness using a sinterable Cu nanoparticle paste. A 50μm size...
journal article 2023
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Li, Shizhen (author), Liu, Yang (author), Ye, H. (author), Liu, X. (author), Sun, Fenglian (author), Fan, Xuejun (author), Zhang, Kouchi (author)
This paper studied the behaviors of sintering between Ag nanoparticle (NP) and nanoflake (NF) in the same size by molecular dynamics simulation. Before the sintering simulation, the melting simulation of NF was carried out to calculate the melting points of NFs and investigate the thermostability of NF. The Lindemann index and potential...
journal article 2022
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Hu, D. (author), Cui, Z. (author), Fan, J. (author), Fan, X. (author), Zhang, Kouchi (author)
A molecular dynamics (MD) simulation was performed on the coalescence kinetics and mechanical behavior of the pressure-assisted Cu nanoparticles (NPs) sintering at low temperature. To investigate the effects of sintering pressure and temperature on the coalescence of the nanoparticles, sintering simulations of two halve Cu NPs were conducted at...
journal article 2020
Searched for: subject%3A%22nanoparticles%22
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