Searched for: subject%3A%22on%255C-wafer%22
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Liu, Kevin (author)
This master’s thesis explores the application of Self-Supervised Contrastive Learning (SSCL), specifically the SimCLR algorithm, to enhance feature representation learning from Wafer Bin Maps (WBM) in the semiconductor manufacturing process. The motivation stems from the industry’s growing need for automated defect detection and root-cause...
master thesis 2023
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Wielaard, Bram (author)
This thesis describes the process of designing a visual effect to replace the needle indicator of a rattrapante complication. The mechanisms of the chronograph and rattrapante are explained as well as the importance of aesthetics in the luxury watchmaking industry. After establishing a method to determine a feasible design, the criteria that...
master thesis 2023
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Shokrolahzade, E. (author), De Martino, C. (author), Spirito, M. (author)
In this contribution we present an approach to reduce the error arising from the variations of the lumped load, due to process spread, in probe level calibrations. First, full-wave electromagnetic (EM) simulations are employed to generate the nominal standard responses, then a parametric EM simulation of the load structure is used to generate a...
conference paper 2023
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Romijn, J. (author), Vollebregt, S. (author), de Bie, Vincent G. (author), Middelburg, L.M. (author), el Mansouri, B. (author), van Zeijl, H.W. (author), May, Alexander (author), Erlbacher, Tobias (author), Leijtens, J.A.P. (author), Zhang, Kouchi (author), Sarro, Pasqualina M (author)
The next generation of satellites will need to tackle tomorrow's challenges for communication, navigation and observation. In order to do so, it is expected that the amount of satellites in orbit will keep increasing, form smart constellations and miniaturize individual satellites to make access to space cost effective. To enable this next...
journal article 2023
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Pezone, R. (author), Baglioni, G. (author), Sarro, Pasqualina M (author), Steeneken, P.G. (author), Vollebregt, S. (author)
A repeatable method to fabricate multi-layer graphene (ML-gr) membranes of 2r = 85 - 155 μm (t < 10 nm) with a 100% yield on 100 mm wafers is demonstrated. These membranes show higher sensitivity than a commercial MEMS-Mic combined with an area reduction of 10x. The process overcomes one of the main limitations when integrating graphene...
conference paper 2023
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Romijn, J. (author)
doctoral thesis 2022
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Bagwe, Sahil (author)
By 2030, the global semiconductor industry is projected to hit the valuation of becoming a trillion dollar industry. Advancements in electronic devices have gave rise to tougher requirements thereby requiring the manufacturers to push the limits of consistency. This has lead to a need to enhance the accuracy of the chip manufacturing process....
master thesis 2022
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van Driel, Tim (author)
In this design study a new design is proposed for an in situ surface inspection tool that can rapidly detect micrometer sized water droplets on a silicon wafer. This surface inspection tool is part of a proposed redesign of the thermal conditioning stage of VDL-ETGs atmospheric wafer handler. A meticulous requirements study was performed, and...
master thesis 2022
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Benónísdóttir, Ragnheiður (author)
Microchips are made from circular silicon discs called wafers and are manufactured with photolithography. A critical step of a photolithography process is when a wafer with a photoresist is placed on a wafer table (WT) and exposed to light to form patterns that build up components of an integrated circuit (IC). The dimensions of the IC are in...
master thesis 2022
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Di Paola, Leonardo (author)
The evolution of microphone technology can be linked to the growing multimedia and communication market. The first is linked to the music and audiovisual industry, while the latter is linked to smartphones, smart mobility, and home automation. In all of these audio applications, the common trend is toward downsizing and performance improvement....
master thesis 2022
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Yin, Haoyang (author)
As demand for chips increases and critical dimension keeps shrinking, the inspection of wafer becomes one of the critical challenges in the high volume production of chips. Coherent Fourier scatterometry (CFS) is a scanning bright field technique that is capable to detect nanoparticles on Si surfaces. The optical readout of CFS consists of a two...
master thesis 2022
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Thukral, V. (author), van Soestbergen, M. (author), Zaal, J.J.M. (author), Roucou, R. (author), Rongen, R.T.H. (author), van Driel, W.D. (author), Zhang, Kouchi (author)
Board level vibration testing is intended to assess prediction of the reliability of solder joint interconnects that are formed between electronic components and printed circuit boards (PCB). Frailties in the stress test experiment might lead to false board level reliability (BLR) evaluations. Therefore, it is essential to have a well...
review 2022
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Pezone, R. (author), Baglioni, G. (author), Sarro, Pasqualina M (author), Steeneken, P.G. (author), Vollebregt, S. (author)
During the past decades micro-electromechanical microphones have largely taken over the market for portable devices, being produced in volumes of billions yearly. Because performance of current devices is near the physical limits, further miniaturization and improvement of microphones for mobile devices poses a major challenge that requires...
journal article 2022
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Huijer, A.J. (author), Kassapoglou, C. (author), Pahlavan, Lotfollah (author)
Piezoelectric sensors can be embedded in carbon fibre-reinforced plastics (CFRP) for continuous measurement of acoustic emissions (AE) without the sensor being exposed or disrupting hydro- or aerodynamics. Insights into the sensitivity of the embedded sensor are essential for accurate identification of AE sources. Embedded sensors are considered...
journal article 2021
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Yuan, Cadmus (author), Fan, Xuejun (author), Zhang, Kouchi (author)
Solder joint fatigue is one of the critical failure modes in ball-grid array packaging. Because the reliability test is time-consuming and geometrical/material nonlinearities are required for the physics-driven model, the AI-assisted simulation framework is developed to establish the risk estimation capability against the design and process...
journal article 2021
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Li, Ye (author), Mirza Gheytaghi, Amir (author), Trifunovic, M. (author), Xu, Yuanxing (author), Zhang, Kouchi (author), Ishihara, R. (author)
3D integration has well-developed for traditional CMOS technology operating at room temperature, but few studies have been performed for cryogenic applications such as quantum computers. In this paper, a wafer-to-wafer bonding of superconductive joints based on niobium nitride (NbN) is performed to demonstrate the possibility of 3D...
journal article 2021
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van 't Hof, Jos (author)
Commercial interest for millimeter-wave wireless communication has increased significantly over the past years due to the appearance of large volume applications such as automotive radar and telecom applications, i.e. as 5G systems operating in the FR2 band, ISM applications in the 60 GHz E-band, and beyond 100 GHz in the W-band and D-band....
master thesis 2020
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Velea, A. (author), Vollebregt, S. (author), Wardhana, G.K. (author), Giagka, Vasiliki (author)
This paper reports on the characterization of a microfabricated wafer-scale, graphene-based, soft implant for spinal cord applications. Graphene is used because of its high transparency and good conductivity, making it suitable for optogenetic applications. Moreover it has a high mechanical strength and is potentially biocompatible. The implant...
conference paper 2020
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Galatro, L. (author)
As the number of wireless applications increases every year, overcrowding the RF/microwave spectrum, research community and industry are gradually starting to dedicate more attention to the less exploited (sub)millimeter wave spectrum, spanning from 30 GHz to 1 THz. While the high frequency and large available bandwidth of the latter promises...
doctoral thesis 2019
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Zoutendijk, Mike (author)
Structure Optimization has been an important subject with many applications for centuries. In the last sixty years, numerical optimization has facilitated large advancements in this field. One of the areas in Structure Optimization is Topology Optimization, which is used for Additive Manufacturing purposes. In this thesis we explore Static and...
master thesis 2019
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