Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network

Considerable advancements in power semiconductor devices have resulted in such devices being increasingly adopted in applications of energy generation, conversion, and transmission. Hence, we proposed a fan-out panel-level packaging (FOPLP) design for 30-V Si-based metal-oxide-semiconductor field-effect transistor (MOSFET). To achieve...

Prognostics of radiation power degradation lifetime for ultraviolet light-emitting diodes using stochastic data-driven models

With their advantages of high efficiency, long lifetime, compact size and being free of mercury, ultraviolet light-emitting diodes (UV LEDs) are widely applied in disinfection and purification, photolithography, curing and biomedical devices. However, it is challenging to assess the reliability of UV LEDs based on the traditional life test or...

A stochastic process based reliability prediction method for LED driver

In this study, we present a general methodology that combines the reliability theory with physics of failure for reliability prediction of an LED driver. More specifically, an integrated LED lamp, which includes an LED light source with statistical distribution of luminous flux, and a driver with a few critical components, is considered. The...