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Wang, Chieh (author)This study deals with the challenge of warpage in power modules, vital components in the rapidly expanding electric and hybrid-electric vehicle industry. The variations in temperature during manufacturing, resulting in significant warpage changes, contribute to device cracks, delamination, and reduced reliability.<br/>The primary focus is...master thesis 2023
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Manos, Peter (author)For the first time since the 1970s, concrete plans are in motion to bring humans back to the Moon through the Artemis programme. The dawning era of space exploration aims to set the groundwork for long-term off-Earth settlement, with sights on bringing the first humans to Mars. In order to provide a safe means of inhabiting extraterrestrial (ET)...master thesis 2023
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- Liu, X. (author) doctoral thesis 2023
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Sattari, R. (author), Hu, D. (author), Liu, X. (author), van Zeijl, H.W. (author), Vollebregt, S. (author), Zhang, Kouchi (author)The rapid development of power electronics has challenged the thermal integrity of semiconductor packaging. Further developments in this domain can be supported significantly by utilizing fast and flexible thermal characteristic evaluation. This study employs the transient dual interface method (TDIM) to characterize and compare the thermal...journal article 2023
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Goel, Avishek (author), Ismailov, Arnold (author), Mohammadzadeh Moghaddam, E. (author), He, Chao (author), Konttinen, Jukka (author)Biomass Chemical Looping Gasification (BCLG) is a cost-effective and efficient alternative to conventional gasification. The selection of appropriate oxygen carriers (OCs) is crucial for stable BCLG performance. These OCs need to possess high reactivity, selectivity, material strength, and resistance to sintering. The study investigated...journal article 2023
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Long, Xu (author), Chong, Kainan (author), Su, Yutai (author), Du, L. (author), Zhang, Kouchi (author)The stress–strain response of sintered silver nanoparticles (AgNP) materials is precisely characterized in order to adapt for numerical analysis and rational design of electronic packaging structures in this study. A framework of crystal plasticity finite element method (CPFEM) is established based on the mechanism of crystal plastic...journal article 2023
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Cernuschi, Federico (author), Kulczyk-Malecka, Justyna (author), Zhang, Xun (author), Nozahic, Franck (author), Estournès, Claude (author), Sloof, W.G. (author)The thermal diffusivity and conductivity of dense and porous binary composites having an insulating and conducting phase were studied across its entire composition range. Experimental evaluation has been performed with MoSi<sub>2</sub> particles embedded into yttria partially stabilized zirconia (YPSZ) as prepared by spark plasma sintering ...journal article 2023
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Živković, Aleksandar (author), Solsona-Delgado, Vanessa (author), van der Linden, B. (author), de Leeuw, Nora H. (author), Melián-Cabrera, Ignacio (author)A descriptor of active CuO-ZnO(Al<sub>2</sub>O<sub>3</sub>) methanol-synthesis and water–gas-shift catalysts is the presence of high-temperature carbonates (HT-CO<sub>3</sub>) in the oxidic catalyst precursor. Previous reports have shown that such HT-CO<sub>3</sub> lead to an appropriate interaction between the oxides; as a result, a high Cu...journal article 2023
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Qian, Cheng (author), Hu, D. (author), Liu, Xu (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)Nano-metal materials sintering has received increasing attention in recent years for its promising performance in the wide bandgap semiconductor packaging. In this paper, molecular dynamics (MD) simulation method were applied to simulate the nano-Cu sintering mechanism and the subsequent mechanical behavior. Hybrid sintering, comprising...conference paper 2023
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Zhu, Jia-Ning (author), Ding, Z. (author), Borisov, Evgenii (author), Yao, Xiyu (author), Brouwer, J.C. (author), Popovich, Anatoly (author), Hermans, M.J.M. (author), Popovich, V. (author)The pursuit of enhancing NiTi superelasticity through laser powder bed fusion (L-PBF) and [001] texture creation poses a challenge due to increased susceptibility to hot cracking in the resulting microstructure with columnar grains. This limitation restricts NiTi's application and contributes to material waste. To overcome this, we introduce...journal article 2023
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Hu, D. (author), Qian, Cheng (author), Liu, X. (author), Du, L. (author), Sun, Zhongchao (author), Fan, X. (author), Zhang, Kouchi (author), Fan, J. (author)As a promising technology for high-power and high-temperature power electronics packaging, nanocopper (nanoCu) paste sintering has recently received increasing attention as a die-attachment. The high-temperature deformation of sintered nanoCu paste and its underlying mechanisms challenge the reliability of high-power electronics packaging. In...journal article 2023
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Hu, X. (author), Martin, H.A. (author), Poelma, René H. (author), Huang, J.L. (author), Rijckevorsel, H. (author), Scholten, H. (author), Smits, E.C.P. (author), van Driel, W.D. (author), Zhang, Kouchi (author)Resin-reinforced silver (Ag) sintering material is an effective and highly reliable solution for power electronics packaging. The hybrid material’s process parameters strongly influence its microstructure and pose a significant challenge in estimating its effective properties as a thin interconnect layer. This research demonstrates a novel 3D...conference paper 2023
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Sattari, R. (author), van Zeijl, H.W. (author), Zhang, Kouchi (author)Wide bandgap (WBG) semiconductor technologies enable significant progress in the emergence of power modules. Power cycling at elevated temperatures causes crack or delamination failure, especially at the die-attached bonded interface in the long term. Therefore, the in-situ reliability investigation of power modules, materials, and...conference paper 2023
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Wang, Xinyue (author), Yang, Zhoudong (author), Wang, Boya (author), Chen, Wei (author), Zhang, Kouchi (author), Zhang, Jing (author), Fan, J. (author), Liu, P. (author)Power modules applied in offshore applications are facing risks of corrosion failures on die-attach materials due to high humidity and H<sub>2</sub>S exposure. To investigate such corrosion behavior for sintered die-attach materials, we conducted a study with four groups of samples fabricated using copper and silver metal particles under...journal article 2023
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Shah, Mustafeez Bashir (author)Many semiconductor sensors, particularly MEMS sensors such as inertial, temperature, pressure, and resonance sensors need a vacuum environment for optimal performance and sensitivity in addition to the improvement in their long-term reliability. With the rise of heterogeneous integration with the MEMS and ICs being integrated together, process...master thesis 2022
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jiao, weiping (author)This thesis investigates the all-copper fine pitch bonding process with photoimageable underfill. NanoCU paste is used as interconnect material. A bi-layer photo resist structure is manufactured and lithographic stencil printing is used to apply nanoCu paste. A new underfill injection method is realized by using epoxy resin based photo resist as...master thesis 2022
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Liu, X. (author), Li, Shizhen (author), Tan, C. (author), Gao, Chenshan (author), Liu, Yang (author), Ye, H. (author), Zhang, Kouchi (author)Nano copper sintering technology has great potential to be widely applied in the wide-bandgap semiconductor packaging. In order to investigate the coalescence kinetics of copper nano particles for this application, a molecular dynamic (MD) simulation was carried out at low temperature on a special model containing two substrate and multiple...journal article 2022
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Irshad, Muneeb (author), Rafique, Muhammad (author), Tabish, Asif Nadeem (author), Ghaffar, Abdul (author), Shakeel, A. (author), Siraj, Khurram (author), Ain, Qurat ul (author), Raza, Rizwan (author), Assiri, Mohammed Ali (author), Imran, Muhammad (author)In this study, nickel oxide–Y2O3-doped ZrO2 (NiO-YSZ) composite powder as an anode material was synthesized using a cost-effective combustion method for high-temperature solid oxide fuel cell (SOFC). Further, the effects of sintering temperatures (1200, 1300, and 1400 °C) were studied for its properties in relation to the SOFC performance. The...journal article 2022
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Li, Shizhen (author), Liu, Yang (author), Ye, H. (author), Liu, X. (author), Sun, Fenglian (author), Fan, Xuejun (author), Zhang, Kouchi (author)This paper studied the behaviors of sintering between Ag nanoparticle (NP) and nanoflake (NF) in the same size by molecular dynamics simulation. Before the sintering simulation, the melting simulation of NF was carried out to calculate the melting points of NFs and investigate the thermostability of NF. The Lindemann index and potential...journal article 2022
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Qian, Cheng (author), Gu, Tijian (author), Wang, Ping (author), Cai, Wei (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)Sintered nano-silver die-attach materials have been widely used in high-power electronics packaging because of their high thermal and electrical conductivities. In this study, we characterized the tensile properties of sintered nano-silver particles over a range of strain rates and temperatures, and established the constitutive models. First, 50...journal article 2022