Fan-Out Panel-Level PCB-Embedded SiC Power MOSFETs Packaging

In this article, a novel fan-out panel-level printed circuit board (PCB)-embedded package for phase-leg silicon carbide (SiC) metal-oxide-semiconductor field-effect transistor (MOSFET) power module is presented. Electro-thermo-mechanical co-design was conducted, and the maximum package parasitic inductance was found to be about 1.24 nH at 100...

Lifetime comparison of power semiconductors in three-level converters for 10MW wind turbine systems

The power electronic converter, especially the power semiconductor, is a major contributor to the failure rates of the wind turbine drivetrain. As the temperature is a major driving factor behind the failure mechanisms of these power semiconductors the choice of topology and switching strategy can have a significant effect on the reliability...