Searched for: subject:"system%5C+in%5C+package"
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document
Yi, H. (author)
The rapid development of semiconductor industry in the past decades has reshaped the world tremendously and greatly changed people's lives. Two-dimensional (2D) down-sizing of semiconductor devices following the “Moore's law” for many years is now reaching its boundary conditions of further exponential growth and three-dimensional (3D)...
doctoral thesis 2020
document
Koladouz Esfahani, Z. (author)
doctoral thesis 2017
document
Dong, M. (author)
As we enter era of “intelligence”, an increasing number of smart devices are being equipped around us. Such devices reflect the emerging need in microelectronics industry: increased functionality and miniaturization. As Moore’s law gradually meets its bottleneck, the concept of “More-than-Moore” (MtM) is proposed to address this issue by...
doctoral thesis 2016
document
Palacios Aguilera, N.B. (author)
Packaging has evoluted for years with the sole purpose of protecting the electronics from the environment and providing a suitable operating environment. Integration became a necessity and technologies as System-in-Package emerged and enabled the integration of components built with different technologies within a single package. All this...
doctoral thesis 2013
Searched for: subject:"system%5C+in%5C+package"
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