A Thin-film Reconfigurable SiC Thermal Test Chip for Reliability Monitoring in Harsh Environments

Wide bandgap (WBG) semiconductor technologies enable significant progress in the emergence of power modules. Power cycling at elevated temperatures causes crack or delamination failure, especially at the die-attached bonded interface in the long term. Therefore, the in-situ reliability investigation of power modules, materials, and...

Thermal Expansion and Aging Effects in Neuromorphic Signal Processor

In this paper, we propose an efficient methodology based on a real-time estimator and predictor-corrector scheme for accurate thermal expansion profile and aging evaluation of a neuromorphic signal processor circuit components. As the experimental results indicate, for comparable mesh size, the proposed method is 1~2 order of magnitude more...

Introduction to an in-situ method for rapid measurement of the walls’ thermal resistance in existing buildings

Large deviations observed between the actual and theoretical gas consumption in Dutch dwellings, cast a shadow of doubt on the accuracy of the energy labeling method. In this sense, the accuracy of the calculation methods as well as the inputs being fed, fall under the question. According to several studies, the significance of wall’s thermal...