Searched for: subject:"thermal%5C+resistance"
(1 - 13 of 13)
document
Rasooli, A. (author)
Accurate determination of building’s critical thermo-physical characteristics such as the walls’ thermal resistance, thermal conductivity, and volumetric heat capacity is essential to indicate effective and efficient energy conservation strategies at building level. In practice, the values of these parameters, which determine not only possible...
doctoral thesis 2020
document
Rasooli, A. (author), Itard, L.C.M. (author)
Accurate determination of walls' thermo-physical characteristics is a necessity for execution of energy conservation strategies in existing buildings. In practice, such data is not available because the current determination methods are time expensive and therefore rarely used. Based on the theory of Response Factors, a rapid transient in...
journal article 2019
document
Rasooli, A. (author), Itard, L.C.M. (author)
Accurate and reliable in-situ characterization of buildings’ thermal envelope is of high significance to determine actual energy use and thermal comfort. In this context, walls’ thermal resistance is one of the most critical properties to be identified. Regardless the numerous studies being carried out to accurately measure the actual thermal...
journal article 2018
document
Tang, H. (author), Ye, Huai-Yu (author), Chen, Xian-Ping (author), Qian, Cheng (author), Fan, Xue-Jun (author), Zhang, Kouchi (author)
In this paper, the heat transfer performance of the multi-chip (MC) LED module is investigated numerically by using a general analytical solution. The configuration of the module is optimized with genetic algorithm (GA) combined with a response surface methodology. The space between chips, the thickness of the metal core printed circuit board...
journal article 2017
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van Loren, A. (author), van Leuken, T.G.R.M. (author)
In this paper, we propose an efficient methodology based on a real-time estimator and predictor-corrector scheme for accurate thermal expansion profile and aging evaluation of a neuromorphic signal processor circuit components. As the experimental results indicate, for comparable mesh size, the proposed method is 1~2 order of magnitude more...
conference paper 2016
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Cai, Z. (author), van Veldhoven, Robert H.M. (author), Falepin, A. (author), Suy, H. (author), Sterckx, E. (author), Bitterlich, C. (author), Makinwa, K.A.A. (author), Pertijs, M.A.P. (author)
This paper reports a readout circuit for a resistive CO2 sensor, which operates by measuring the CO2-dependent thermal conductivity of air. A suspended hot-wire transducer, which acts both as a resistive heater and temperature sensor, exhibits a CO2-dependent heat loss to the surrounding air, allowing CO2 concentration to be derived from its...
journal article 2016
document
Setekera, R. (author)
With the current increasing demand for faster and more reliable communication and computing electronic devices such as faster wireless communication networks, circuit designers are forced to carry out device optimization in order to achieve the maximum possible performance. To enable full circuit optimization, designers depend on compact models...
doctoral thesis 2016
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Rasooli, A. (author), Itard, L.C.M. (author), Infante Ferreira, C.A. (author)
Large deviations observed between the actual and theoretical gas consumption in Dutch dwellings, cast a shadow of doubt on the accuracy of the energy labeling method. In this sense, the accuracy of the calculation methods as well as the inputs being fed, fall under the question. According to several studies, the significance of wall’s thermal...
conference paper 2016
document
Ottelé, M. (author)
Planting on roofs and façades is one of the most innovative and fastest developing fields of green technologies with respect to the built environment and horticulture. This thesis is focused on vertical greening of structures and to the multi-scale benefits of vegetation. Vertical green can improve the environment in urban areas and is becoming...
doctoral thesis 2011
document
Glavatskiy, K.S. (author), Bedeaux, D. (author)
In this paper we calculate the interfacial resistances to heat and mass transfer through a liquid–vapor interface in a binary mixture. We use two methods, the direct calculation from the actual nonequilibrium solution and integral relations, derived earlier. We verify, that integral relations, being a relatively faster and cheaper method, indeed...
journal article 2010
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Nanver, L.K. (author), Schellevis, H. (author), Scholtes, T.L.M. (author), La Spina, L. (author), Lorito, G. (author), Sarubbi, F. (author), Gonda, V. (author), Popadic, M. (author), Buisman, K. (author), De Vreede, L.C.N. (author)
This paper reviews special RF/microwave silicon device implementations in a process that allows two-sided contacting of the devices: the back-wafer contacted silicon-on-glass (SOG) substrate-transfer technology (STT) developed at DIMES. In this technology, metal transmission lines can be placed on the low-loss glass substrate, while the...
journal article 2009
document
La Spina, L. (author)
Nowadays, electrothermal effects (ET) are posing fundamental issues in nearly all branches of micro- and nano-electronics. Due to either a high power dissipation level or to the aggressive electrical isolation schemes adopted to increase the speed, both high and low power devices are affected by ET effects that limit their reliability and cause...
doctoral thesis 2009
document
van den Assem, D. (author), Daniels, D.H.W. (author)
report 1978
Searched for: subject:"thermal%5C+resistance"
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