Transient thermal measurement on nano-metallic sintered die-attach joints using a thermal test chip

The rapid development of power electronics has challenged the thermal integrity of semiconductor packaging. Further developments in this domain can be supported significantly by utilizing fast and flexible thermal characteristic evaluation. This study employs the transient dual interface method (TDIM) to characterize and compare the thermal...

Buckling, Post-buckling and Vibrations of Composite Plates under Combined Thermomechanical Loads

A big technological leap in Carbon Fibre Reinforced Plastics (CFRP's) has brought to the market materials that are able to operate under severe thermomechanical loading conditions and yet remain lightweight. This is of high interest for new developments in aerostructures, such as supersonic airliners or the hydrogen aircraft. A continuous need...

Investigation on buckling and mode jumping of composite plates under thermomechanical loads

This paper presents an experimental and numerical study of composite plates, analyzing the interaction between mechanical and thermal loads related to buckling and the occurrence of mode jumping. A novel experimental setup for thermomechanical testing was developed. The setup is conceived around a frame with a low coefficient of thermal...

Vibration-buckling tests on heated composite plates

This paper presents an experimental investigation on vibrations of heated composite plates leading to thermal buckling. The tests were performed considering two main goals: the application of the Vibration Correlation Technique for the detection of thermal buckling in composite plates; and the exploration of the frequency variations before...

In-situ reliability monitoring of power packages using a Thermal Test Chip

With an increasing demand for high-power electronics, the need to meet stringent automotive norms and better understand the critical failure mechanisms are crucial in order to improve their reliablity. To that end, we developed an in-situ reliability monitoring setup capable of actively measuring the thermal performance of the package during...

Design and Fabrication of a Multi-Functional Programmable Thermal Test Chip

This paper focuses on the design and fabrication of a new programmable thermal test chip as a flexible and cost-effective solution for simplification of characterization/prototyping of new packages. The cell-based design format makes the chip fit into any modular array configuration. One unit cell is as small as 4x4 mm2, including 6 individually...

A study on thermal buckling and mode jumping of metallic and composite plates

Composite plates in post-buckling regime can experience mode jumping in their buckling shape, suddenly increasing the number of half-waves. This phenomenon can be advantageous, be-cause the shape change could be used for local morphing or structural adaptability in future aerospace structures. A study of this phenomenon under heating is here...

Developing thermal testing methods for a locomotion system of a Phobos rover

In 2024, a rover will leave Earth on a daring mission to explore Phobos, one of the two moons of Mars. Phobos has a severe thermal environment, with surface temperatures ranging from -153 °C to +57 °C and an 8-hour diurnal cycle. This work focuses on validating the performance of the locomotion system of the Mars Moon eXploration (MMX) rover....