Wafer-level direct bonding of optimized superconducting NbN for 3D chip integration

3D integration has well-developed for traditional CMOS technology operating at room temperature, but few studies have been performed for cryogenic applications such as quantum computers. In this paper, a wafer-to-wafer bonding of superconductive joints based on niobium nitride (NbN) is performed to demonstrate the possibility of 3D...

Wafer Scale Flexible Interconnect Fabrication for Heterogeneous Integration

System in a package (SIP) allows integrated circuit (ICs) modules or other components from different suppliers and technologies to be integrated into highly functional products. This SIP could realize miniaturized and multifunctional systems enabling emerging technologies like solid-state lightening (SSL), internet of things (IOT), etc. Due to...

Low Temperature Wafer Bonding Based on Copper Nanoparticle Sintering for 3D Interconnect Fabrication

The current thesis is organized into 7 chapters. Chapter 1 offers a brief overview of the current research work and presents the project objectives, report structure and the relevant 3D integration challenges . The introductory section 1.1 provides the motivation for the current work by matching the current requirements in 3D integration with...

MEMS monocrystalline-silicon based thermal devices for chemical and microfluidic applications

This thesis explores the employment of monocrystalline silicon in microsystems as an active material for different thermal functions, such as heat generation and heat transfer by conduction. In chapter 1 applications that need thermal micro devices, micro heaters and micro heat exchangers, are briefly introduced. The shortcomings of commonly...

DRIE and Bonding Assisted Low Cost MEMS Processing of In-plane HAR Inertial Sensors

We present a simple, flexible and low cost MEMS fabrication process, developed using deep reactive ion etching (DRIE) and wafer bonding technologies, for manufacturing in-plane high aspect ratio (HAR) inertial sensors. Among examples, the design and fabrication results of a two axis inertial device are presented. Fabricated device thickness...