Searched for: subject:"wafer%5C+bonding"
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Li, J. (author)
System in a package (SIP) allows integrated circuit (ICs) modules or other components from different suppliers and technologies to be integrated into highly functional products. This SIP could realize miniaturized and multifunctional systems enabling emerging technologies like solid-state lightening (SSL), internet of things (IOT), etc. Due to...
master thesis 2015
Damian, A. (author)
The current thesis is organized into 7 chapters. Chapter 1 offers a brief overview of the current research work and presents the project objectives, report structure and the relevant 3D integration challenges . The introductory section 1.1 provides the motivation for the current work by matching the current requirements in 3D integration with...
master thesis 2013