Drinking water quality deteriorates from treatment plant to customer taps, especially in the plumbing system. There is no direct evidence about what the differences are contributed by plumbing system. This study compared the water quality in the water main and at customer tap by preparing a sampling tap on the water main. The biomass was quantified by adenosine triphosphate (ATP) and the microbial community was profiled by 454 pyrosequencing. The results showed that in distribution pipes, biofilm contributed >94% of the total biomass, while loose deposits showed little contribution (< 2%) because of the low amount of loose deposits. The distribution of biological stable water had minor effects on the microbiocidal water quality regarding both quantity (ATP 1 ng/L vs. 1.7 ng/L) and community of the bacteria. Whereas the plumbing system has significant contribution to the increase of active biomass (1.7 ng/L vs. 2.9 ng/L) and the changes of bacterial community. The relative abundance of Sphingomonas spp. at tap (22%) was higher than that at water main (2%), while the relative abundance of Pseudomonas spp. in tap water (15%) was lower than that in the water from street water main (29%). Though only one location was prepared and studied, the present study showed that the protocol of making sampling tap on water main offered directly evidences about the impacts of plumbing system on tap water quality, which makes it possible to distinguish and study the processes in distribution system and plumbing system separately.

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The large and steadily growing demand for medicines combined with their inherent resource-intensive manufacturing necessitates a relentless push for their sustainable production. Pharmaceutical companies are constantly seeking to perform reliable life cycle assessments of their medicinal products and assess the true value of their sustainable development achievements; however, they find themselves impeded by the lack of a universal metric system that allows for objective quantification of the underlying core denominators. Guided by the unambivalent purpose of the United Nations Sustainable Development Goal 12, which aims at substantially reducing production waste by 2030, and driven by a vision to catalyze greener active pharmaceutical ingredient (API) manufacturing around the globe, the authors set out to overcome current obstacles by defining an improved model for the metric named innovation green aspiration level, iGAL 2.0. We propose yield and convergence as new key sustainability indicators and include a new formula for convergence with potential applicability in computer assisted synthesis planning (CASP) algorithms. The improved statistical model of iGAL 2.0 represents a valuable extension to the common API process waste metrics, process mass intensity (PMI) and complete E factor (cEF), by putting those measures into perspective: iGAL 2.0 enables determination of relative process greenness (RPG) to identify potentially underperforming and environmentally concerning processes early and thereby deliver environmental value. At the same time, iGAL 2.0 generates economic value since reduced waste correlates to lower API production costs. The metric is complemented by its scorecard companion to highlight the impact of innovation on reductions of API manufacturing waste, enabling scientists to readily communicate the value of their work to their peers, managers, and the general public. We believe that iGAL 2.0 can readily be adopted by pharmaceutical firms around the globe and thereby empower and inspire their scientists to make meaningful and significant contributions to global sustainability.

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With the advent of wide-band gap (WBG) semiconductors such as SiC and GaN, it is believed that the Si-based semiconductors will be replaced in high-frequency and high-power application fields soon. At the same time, it calls for better electronic packaging technologies and packaging materials which can ensure devices survive at higher power density. Embedded packaging and metal-based sintering die attachment technologies are recently the most advanced ideas. It can not only minimize the packaging volume to increase power density but also enhance thermal conductivity to lower down thermal stress for the device. In this paper, we conducted a comparative study by finite element method (FEM) simulation to reveal the advancement of such techniques. First, four different packaging structures are considered, including the traditional surface mounted packaging method, the embedded packaging design, embedded thick copper design and the double-sided cooling design. Second, study on thermal dissipation properties of different die-attachment (DA) material have been carried out. The results show that the last two designs significantly reduce the service temperature of the packaging, and both the silver and copper sintering technologies can provide good DA layer without high thermal stress.@en

SiC devices are promising for outperforming Si counterparts in high-frequency applications due to its superior material properties. Conventional wirebonded packaging scheme has been one of the most preferred package structures for power modules. However, the technique limits the performance of a SiC power module due to parasitic inductance and heat dissipation issues that are inherent with aluminum wires. In this article, low parasitic inductance and high-efficient cooling interconnection techniques for Si power modules, which are the foundation of packaging methods of SiC ones, are reviewed first. Then, attempts on developing packaging techniques for SiC power modules are thoroughly overviewed. Finally, scientific challenges in the packaging of SiC power module are summarized.

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The electrochemical reduction of carbon monoxide is a promising approach for the renewable production of carbon-based fuels and chemicals. Copper shows activity toward multi-carbon products from CO reduction, with reaction selectivity favoring two-carbon products; however, efficient conversion of CO to higher carbon products such as n-propanol, a liquid fuel, has yet to be achieved. We hypothesize that copper adparticles, possessing a high density of under-coordinated atoms, could serve as preferential sites for n-propanol formation. Density functional theory calculations suggest that copper adparticles increase CO binding energy and stabilize two-carbon intermediates, facilitating coupling between adsorbed *CO and two-carbon intermediates to form three-carbon products. We form adparticle-covered catalysts in-situ by mediating catalyst growth with strong CO chemisorption. The new catalysts exhibit an n-propanol Faradaic efficiency of 23% from CO reduction at an n-propanol partial current density of 11 mA cm⁻².

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