H

H. R.

2 records found

Authored

Epoxy Mold Compounds (EMC) are used to protect integrated circuits (IC) from environmental influences, with one of these influences being moisture ingress, causing corrosion. To obtain the needed thermal and mechanical properties EMCs require a high loading of (silica) fillers ...

A combined experimental and numerical investigation is conducted on the anisotropic water diffusion behaviour of unidirectional glass/epoxy composites. Experimental diffusivity values are obtained by immersing thin material slices for each of its planes of orthotropy extracted ...