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Sintered nano-silver die-attach materials have been widely used in high-power electronics packaging because of their high thermal and electrical conductivities. In this study, we characterized the tensile properties of sintered nano-silver particles over a range of strain rates a
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Constitutive Modeling of Sintered Nano-silver Particles
A Variable-order Fractional Model versus an Anand Model
In high-power electronics packaging, nano-silver sintering technology has been widely applied due to its excellent electrical and thermal conductivity and its low-temperature packaging and high-temperature operation. In this study, 50-nm nano-silver particles are sintered at 2 ...
This paper introduces a novel technique to design the level of service (LOS) for facilities or sub spaces of buildings for the purpose of evacuation planning. LOS is a standard qualitative indicator used to describe flow characteristics in a pedestrian environment. Some evacua ...