16 records found

Rare earth elements (REEs) are vital to the development of low-carbon technologies. There are rising concerns in the United States and elsewhere about REE supply chain stability and risks given the unvalidated perception in the heavy reliance of China, by far the largest REE supp ...
During operation in environments containing hydrogen sulfide (H2S), such as in offshore and coastal environments, sintered nanoCu in power electronics is susceptible to degradation caused by corrosion. In this study, experimental and molecular dynamics (MD) simulation ...
Rare earth elements (REEs) are vital to the development of low-carbon technologies. There are rising concerns in the United States and elsewhere about REE supply chain stability and risks given the unvalidated perception in the heavy reliance of China, by far the largest REE supp ...
Titanium carbide MXene, Ti3C2Tx, exhibits ultrahigh capacitance in acidic electrolytes at negative potentials yet poor stability at positive potentials, resulting in low-energy densities for Ti3C2Tx-based symmetric ...
Thermal management has always played a significant role in power module design. Double-sided heat dissipation is more efficient at transferring heat than the traditional package. Although there are several thermal modeling approaches to power modules, the application of the numer ...
Considerable advancements in power semiconductor devices have resulted in such devices being increasingly adopted in applications of energy generation, conversion, and transmission. Hence, we proposed a fan-out panel-level packaging (FOPLP) design for 30-V Si-based metal-oxide-se ...
Power modules applied in offshore applications are facing risks of corrosion failures on die-attach materials due to high humidity and H2S exposure. To investigate such corrosion behavior for sintered die-attach materials, we conducted a study with four groups of sampl ...
As the next generation of semiconductor devices, SiC MOSFETs have demonstrated significant performance improvements in switching loss, switching frequency, and high-temperature operation compared to Si-based MOSFETs. However, the long-term reliability of such devices and their pa ...
SiC MOSFET is mainly characterized by the higher electric breakdown field, higher thermal conductivity, and lower switching loss enabling high breakdown voltage, high-temperature operation, and high switching frequency. However, their performances are considerably limited by the ...
Double-sided packages for heat dissipation are an efficient thermal management mechanism for power semiconductor devices. A fan-out panel-level packaging (FOPLP), as one of the double-sided forms, exhibits excellent electro–thermal characteristics and provides low stray inductanc ...
A fan-out panel-level packaging (FOPLP) with an embedded redistribution layer (RDL) via interconnection reduces the size, thermal resistance, and parasitic inductance of power module packaging. In this study, the effect of the RDL via size on the reliability of a FOPLP SiC MOSFET ...
The kinetics of the transformation of metallic Fe to the active Fe carbide phase at the start of the Fischer-Tropsch (FT) reaction were studied. The diffusion rates of C atoms going in or out of the lattice were determined using 13C-labeled synthesis gas in combination with measu ...

Luminous performances characterization of YAG

Ce3+ phosphor/silicone composites using both reflective and transmissive laser excitations

YAG: Ce3+ phosphor/silicone composites are widely used in solid-state lighting as a light converter to achieve white lighting. However, because of high thermal resistance and low thermal stability, the luminous performance of YAG: Ce3+ phosphor/silicone composite deteriorates rap ...

Sulfur-Rich Ageing Mechanism of Silicone Encapsulant Used in LED Packaging

An Experimental and Molecular Dynamic Simulation Study

In a light-emitting diode (LED) package, silicone encapsulant serves as a chip protector and enables the light to transmit, since it exhibits the advantages of high light transmittance, high refractive index, and high thermal stability. However, its reliability is still challenge ...

Dynamic mechanical analysis of (Ca,Sr)AlSiN3

Eu2+ phosphor/silicone composites aged under the temperature–humidity–sulfur coupled condition

As a core packaging material of light color conversion, phosphor/silicone composite plays an indispensable role in light emitting diode (LED) packaging. At present, commercial LED packages mainly use blue LED chips to stimulate Yttrium Aluminum Garnet (YAG) yellow phosphor to rea ...
As one of solid state lighting sources, wafer-level chip scale Light Emitting Diode (LED) packages has gained much attention, because of its compact size, high power and high optical performance. For this package to be effective, the solder layer plays the critical role in heat d ...